3 . Reflow Soldering (profiles, atmosphere, defects)

Soldering is an unforgiving metallurgical process. Exposing a PCB to an incorrect thermal profile will either result in weak, brittle joints or severe damage to the components and the laminate.

Profiling a reflow oven is not a one-time setup; it requires continuous verification against the specific thermal mass of each assembly. We examine the zones of the reflow process, the impact of nitrogen atmospheres, and the root causes of classic defects like tombstoning and voiding.