1. Automated THT: selective & wave

Because wave soldering and selective soldering subject a PCBA to significant thermal activity, it is important that operating parameters are carefully managed. Improperly calculated parameters can cause thermal shock to SMT components or result in insufficient solder on THT joints.

This chapter outlines wave dynamics, flux spread, and pre-heating profiles. It offers guidance on the machine setup generally required to achieve reliable barrel fill while minimizing bridging, icicles, and excessive dross generation.