1.2 RFQ intake checklist & golden data pack
Manufacturing speed relies on data integrity. An incomplete or ambiguous RFQ package halts the
The Golden Data Pack: Mandatory Inputs
Section titled “The Golden Data Pack: Mandatory Inputs”The inputs must be defined clearly to prevent engineering holds.
1. Bill of Materials (BOM)
Section titled “1. Bill of Materials (BOM)”The BOM drives procurement and machine programming.
- Format: The file must be machine-readable (XLS, CSV).
- PDF or Image formats must be rejected immediately. Manual transcription introduces a non-zero error risk.
- Manufacturer Part Numbers (MPN):
- Critical components (such as ICs or Connectors) require a specific, defined MPN.
- Generic components (such as Resistors or Capacitors) require fully defined specifications: Case (e.g. 0402), Value (e.g. 10k), Tolerance (e.g. 1%), and Voltage (e.g. 50V).
- Alternates Policy:
- When strict control is required, the item must be flagged clearly as “No Substitutes.”
- When cost optimization is preferred, the item must be flagged as “Alternates Allowed,” allowing Engineering to formally validate options for form, fit, and function.
Pro-Tip: Excel formulas often corrupt part numbers (e.g. converting part “SEPT1” to a date). All BOM columns must be forced to “Text” format before saving.
2. PCB Data (Gerbers & ODB++)
Section titled “2. PCB Data (Gerbers & ODB++)”Fabrication and Assembly require different data sets.
- Fabrication Data: Gerber
RS-274X is standard.- Designs utilizing blind or buried vias require a drill chart that explicitly defines the layer pairs.
- Assembly Data:
ODB ++ is the preferred format when available, as it contains the netlist, stackup, and XY data in a single container.- When relying on
Gerbers , a separate Pick & Place (Centroid/XY) file containing: RefDes, X, Y, Rotation, and Side (Top/Bot) must be provided.
3. Assembly drawings & visuals
Section titled “3. Assembly drawings & visuals”Data files provide coordinates; drawings provide context.
- Polarity & Orientation:
- Designs containing polarized components (Diodes, ICs, Connectors) require an assembly drawing that clearly identifies Pin 1 or the Cathode.
- Risk: The silkscreen is frequently obscured by the component body itself. PCB ink must never be relied upon solely for post-placement inspection.
- Special Instructions:
- Components designated as “Do Not Populate” (DNP) must be clearly identified by RefDes within the BOM or on the Assembly Drawing.
4. Test & programming
Section titled “4. Test & programming”- Microcontrollers:
- Pre-programming requirements necessitate the provision of the Hex/Bin file, the Checksum, and the necessary Voltage settings.
Functional Test :- ICT or
FCT requirements necessitate a “Test Specification Document” defining the Input Stimulus, Expected Output, and Pass/Fail Limits.
- ICT or
5. Revision control
Section titled “5. Revision control”- Synchronization:
- The BOM Revision must match the PCB Revision.
- Any detected mismatch (e.g. BOM Rev A versus PCB Rev B) requires a hard stop. The intent must be formally confirmed before any purchasing activity begins.
RFQ outputs
Section titled “RFQ outputs”Upon receipt, the following must be generated immediately.
Missing-items request template
Section titled “Missing-items request template”Long emails must be avoided. This standard block must be used to request missing data.
Subject: RFQ [Project Name] – Data Hold – Missing Critical Items
The following items are missing from the Data Pack. Quoting/Engineering is paused until received:
[ ] BOM in Excel Format (PDF provided is unusable)
[ ] Pick & Place (XY) File
[ ] Assembly Drawing (Pin 1 orientation undefined)
[ ] Programming File (.hex/.bin)
Please upload missing files by [Date/Time] to maintain schedule.
Final Checkout: RFQ intake checklist & golden data pack
Section titled “Final Checkout: RFQ intake checklist & golden data pack”This table must be used to validate the Data Pack before releasing to Engineering.
| Check Item | Validation Criteria | Criticality |
|---|---|---|
| BOM Format | Native Excel/CSV. No PDF. | BLOCKER |
| MPN Clarity | 100% of lines have MPN or Full Specification. | High |
| XY Data | Present and matches BOM Reference Designator count. | BLOCKER |
| PCB Files | BLOCKER | |
| Polarity | Diodes/ICs have unambiguous orientation marks. | High |
| Revision | BOM Revision matches Gerber Revision. | Medium |
| Alternates | Policy defined (Strict vs. Open). | Low |