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6.1 Measurement System Analysis (MSA / Gauge R&R)
Before trusting data, you must trust the tool that generated it. If your ruler is elastic, every measurement is a lie. Measurement System Analysis (MSA) quantifies the error introduced by the gauge and the operator. It answers the critical question: "Is the va...
3.5 First Article Inspection (AS9102)
First Article Inspection (FAI) is not merely a "golden sample" check; it is a forensic validation of the manufacturing process. We do not just measure the part; we audit the process that created it. If the first unit off the line is a fluke, the next thousand ...
3.1 APQP & PPAP
Quality cannot be inspected into a product; it must be designed into the process. Advanced Product Quality Planning (APQP) is the architecture of prevention, ensuring that physical reality matches engineering intent before the cash burn of mass production begi...
3.3 Failure Mode and Effects Analysis (FMEA)
FMEA is not paperwork; it is the mathematical prediction of the future. It forces engineers to stare into the abyss of "What could go wrong?" and build a bridge over it before the first prototype is scrapped. If you treat FMEA as a checkbox exercise to satisfy...
8.3 Root Cause Analysis (RCA) & CAPA
If you are fighting the same fire this week that you fought last month, your CAPA system is broken. Root Cause Analysis (RCA) is the difference between "fixing" a problem and "solving" it. Most organizations stop at the symptom ("Operator error"); true enginee...
5.1 Bare Board Inspection (IPC-A-600)
The Printed Circuit Board (PCB) is not a component; it is the chassis of the entire system. If the foundation is compromised, the best soldering in the world cannot save the product. We utilize IPC-A-600 (Acceptability of Printed Boards) to define the boundary...
5.3 Cable & Harness Assembly (IPC/WHMA-A-620)
Cable assemblies are the nervous system of the product. They are often built by hand, making them the most variable and failure-prone component in the BOM. IPC/WHMA-A-620 is the standard that separates a reliable connection from an intermittent field failure. ...
5.4 Box Build & Mechanical Assembly (IPC-A-630)
The "Box Build" is where precision electronics meet the brutal reality of the physical world. While a PCBA is fragile and static, the final enclosure is dynamic; it must survive drops, vibration, thermal cycles, and user abuse. This chapter governs the "Macro"...
5.5 Cosmetic Inspection Standards (Visual Quality)
Cosmetic inspection is the most dangerous phase of manufacturing because it is subjective. Without quantifiable physics, the production line devolves into an art critique session, driving up scrap costs without adding value. This chapter converts "it looks bad...
5.6 Rework & Repair (IPC-7711/7721)
Rework is not a "Undo" button; it is controlled trauma. Every time you apply a soldering iron to a PCBA, you introduce thermal shock, consume the sacrificial plating, and grow the brittle Intermetallic Compound (IMC) layer. The goal of IPC-7711 (Rework) and IP...
6.1 Changeover Reduction (SMED)
In high-mix electronics manufacturing, the greatest threat to OEE (Overall Equipment Effectiveness) is not slow machine speed, but the idle time between production runs. An SMT line costing $1M generates zero revenue while stationary. Single Minute Exchange of...
6.2 Maintenance & Calibration
While Book 07 covers facility-wide strategies, this chapter defines the specific, tactical maintenance actions required for Surface Mount Technology (SMT) equipment. SMT machines are high-speed precision robots operating in a hostile environment of sticky sold...
2.6 Rework & Repair
Rework and repair are invasive procedures that carry a high risk of Collateral Damage (CD) to the printed circuit board assembly (PCBA). Unlike primary assembly, which relies on automated precision, rework relies on operator skill and strict thermal management...
6.3 Predictive Maintenance (PdM)
Predictive Maintenance is not about fixing machines; it is about buying time. While Preventive Maintenance relies on statistical guesses (replacing parts "just in case"), PdM interrogates the asset for physical signatures of distress—heat, vibration, and noise...
6.6 Root Cause Analysis (RCA)
In Total Productive Maintenance (TPM), "fixing" the machine is merely the first step. The goal is not repair; it is Non-Recurrence. Root Cause Analysis (RCA) is the disciplined engineering forensic process used to convert a failure into an asset of knowledge. ...
4.2 Audits and Capability Verification
Trust is not a quality control strategy. Verification is. A supplier's quality manual in a conference room often bears little resemblance to the reality on their shop floor. The Dannie Operating System mandates a "Go and See" (Gemba) approach. We do not audit ...
4.3 The Incoming Inspection Plan (IQC)
Incoming Quality Control (IQC) is the financial firewall of the EMS factory. Once a defective component is soldered onto a PCB, the cost of rejection increases by factor of 10 (rework) to 100 (scrap). We do not inspect quality into the product; we verify that...
4.4 Supplier Nonconformance (SCAR) Management
A quality system is not defined by its perfection, but by its reaction velocity when entropy strikes. Nonconforming material is a radioactive asset; it must be isolated, identified, and dispositioned immediately to prevent contamination of the production line....
4.5 Supplier Corrective Action (SCAR/8D) + Effectiveness Check
A Supplier Corrective Action Request (SCAR) is not a "complaint form" or an invitation to apologize. It is a formal, legal demand for a systemic engineering change. If you merely ask a supplier to "fix the part," they will rework the inventory and ship you the...
4.6 Change Control and Deviations
The "Golden Process" validated during qualification is the only approved way to manufacture the part. Any variation from this baseline—whether intentional (Change Request) or accidental (Deviation)—introduces unknown variables. We operate under a "No Surprises...