6.2 Put-away & location control
Physical put-away translates “financial possession” into “operational availability.” If a component sits on a warehouse shelf but remains unassigned in the WMS, it acts as a Phantom Shortage. This can cause the MRP system to trigger urgent re-orders while the required stock is already in the building. The primary objective is synchronization: ensuring the physical reality of the inventory matches the digital map in the ERP at all times.
The “scan-to-location” protocol
Section titled “The “scan-to-location” protocol”Relying on human memory for stock transactions must be avoided. Digital updates should occur simultaneously with physical handling, rather than as batch updates later in the shift.
- The Standard WMS Transaction:
- Material must be transported to the target zone.
- The Bin Location Barcode (The Destination) must be scanned.
- The Part ID / License Plate Barcode (The Item) must be scanned.
- The Quantity must be confirmed.
- The item must be placed securely into the bin.
- Handling Guidelines:
- The Protocol: If a scanner is unavailable, moving the physical box must be delayed until real-time tracking can be maintained.
- The Protocol: If the system suggests a bin that is already full, the material must be scanned into a designated “Overflow” location immediately. Leaving material unassigned on the floor must be avoided.
- The Protocol: If an item is found in a bin that the WMS indicates is empty, a Cycle Count must be triggered to reconcile the discrepancy.
Managing broken packs & partial units
Section titled “Managing broken packs & partial units”In high-mix assembly, identifying and tracking “Cut Tape” and partial component reels is a common challenge. Once a manufacturer’s sealed bag or reel is opened, the component’s digital identity can quickly be lost.
- The Guideline: Raw components must be kept linked with their physical identity labels.
- The Protocol: When cutting a strip of tape for a sample or a small kit, it must be ensured the original manufacturer label remains with the bulk stock.
- The Protocol: For cut strips too small to hold the original label, an Internal UID Barcode Label (containing MPN, Lot, and Quantity) must be generated and affixed to a bag containing the strip.
- Unidentified Loose Parts:
- The Protocol: If loose, unlabelled passive components are found on the floor, it is generally safer to scrap them than to guess their value. The risk of mixing similar-looking components (like a 10kΩ and a 10.1kΩ resistor) is too high for reliable production.
Location strategy & segregation
Section titled “Location strategy & segregation”Warehouse locations must be structured based on component velocity and physical ESD characteristics.
- Velocity Slotting:
- For High-Frequency (Class A) Parts: These must be slotted in the “Golden Zone” (e.g. waist height, near the kitting area) to minimize travel time.
- For Low-Frequency (Class C) Parts: These must be stored in higher/lower racking or in Automated Vertical Lift Modules (VLMs).
- Mixed Bin Guidelines:
- The Ideal State: One SKU per physical Bin ID must be maintained.
- High-Density Storage: If mixed bins are necessary (e.g. partitioned drawers):
- It must be ensured parts that look identical are not stored in adjacent compartments to help prevent picking errors. Clear dividers and distinct labeling must be used.
- ESD Compliance: Active components (ICs, FPGAs) must be stored in Conductive or Static-Dissipative bins/totes. Standard “Pink Poly” is typically insufficient for long-term storage of sensitive devices.
Recap: Put-away & Location Control Procedures
Section titled “Recap: Put-away & Location Control Procedures”| Parameter | Requirement | Condition | Action |
|---|---|---|---|
| WMS Transaction | Scan-to-location protocol | During physical put-away | 1. Scan Bin Location Barcode. 2. Scan Part ID/License Plate Barcode. 3. Confirm Quantity. |
| System Discrepancy | WMS indicates bin is empty, but item is physically present | Found during put-away or picking | Trigger a Cycle Count to reconcile. |
| Full Bin | System-suggested bin is at capacity | During put-away | Scan material into designated “Overflow” location immediately. |
| Broken Pack / Cut Tape | Original manufacturer label is separated from bulk stock | For cut strips too small for original label | Generate and affix Internal UID Barcode Label (MPN, Lot, Quantity) to containing bag. |
| Unidentified Loose Parts | Loose, unlabelled passive components found | On warehouse floor | Scrap components; do not guess identity. |
| Location Slotting | Based on component velocity | For storage assignment | High-frequency (Class A) parts: slot in “Golden Zone”. Low-frequency (Class C) parts: store in high/low racking or VLMs. |
| Bin Segregation | Mixed bins are necessary | For high-density storage (e.g., partitioned drawers) | Do not store identical-looking parts in adjacent compartments. Use clear dividers and distinct labeling. |
| ESD Storage | Storing active components (ICs, FPGAs) | For long-term storage | Use Conductive or Static-Dissipative bins/totes. Standard “Pink Poly” is typically insufficient for long-term storage of sensitive devices. |