1.2 RFQ intake checklist & golden data pack

Manufacturing speed relies on data integrity. An incomplete or ambiguous RFQ package halts the New Product Introduction (NPI) process immediately. We do not guess component values or orientations; we build precisely to the “Golden Data Pack.” This dataset is the immutable source of truth for the entire production lifecycle.

The Golden Data Pack: Mandatory Inputs

The inputs must be defined clearly to prevent engineering holds.

1. Bill of Materials (BOM)

The BOM drives procurement and machine programming.

Format: The file must be machine-readable (XLS, CSV).
- PDF or Image formats must be rejected immediately. Manual transcription introduces a non-zero error risk.
Manufacturer Part Numbers (MPN):
- Critical components (such as ICs or Connectors) require a specific, defined MPN.
- Generic components (such as Resistors or Capacitors) require fully defined specifications: Case (e.g. 0402), Value (e.g. 10k), Tolerance (e.g. 1%), and Voltage (e.g. 50V).
Alternates Policy:
- When strict control is required, the item must be flagged clearly as “No Substitutes.”
- When cost optimization is preferred, the item must be flagged as “Alternates Allowed,” allowing Engineering to formally validate options for form, fit, and function.

2. PCB Data (Gerbers & ODB++)

Fabrication and Assembly require different data sets.

Fabrication Data: Gerber RS-274X is standard.
- Designs utilizing blind or buried vias require a drill chart that explicitly defines the layer pairs.
Assembly Data:
- ODB++ is the preferred format when available, as it contains the netlist, stackup, and XY data in a single container.
- When relying on Gerbers, a separate Pick & Place (Centroid/XY) file containing: RefDes, X, Y, Rotation, and Side (Top/Bot) must be provided.

3. Assembly drawings & visuals

Data files provide coordinates; drawings provide context.

Polarity & Orientation:
- Designs containing polarized components (Diodes, ICs, Connectors) require an assembly drawing that clearly identifies Pin 1 or the Cathode.
- Risk: The silkscreen is frequently obscured by the component body itself. PCB ink must never be relied upon solely for post-placement inspection.
Special Instructions:
- Components designated as “Do Not Populate” (DNP) must be clearly identified by RefDes within the BOM or on the Assembly Drawing.

4. Test & programming

Microcontrollers:
- Pre-programming requirements necessitate the provision of the Hex/Bin file, the Checksum, and the necessary Voltage settings.
Functional Test:
- ICT or FCT requirements necessitate a “Test Specification Document” defining the Input Stimulus, Expected Output, and Pass/Fail Limits.

5. Revision control

Synchronization:
- The BOM Revision must match the PCB Revision.
- Any detected mismatch (e.g. BOM Rev A versus PCB Rev B) requires a hard stop. The intent must be formally confirmed before any purchasing activity begins.

RFQ outputs

Upon receipt, the following must be generated immediately.

Missing-items request template

Long emails must be avoided. This standard block must be used to request missing data.

Subject: RFQ [Project Name] – Data Hold – Missing Critical Items

The following items are missing from the Data Pack. Quoting/Engineering is paused until received:

[ ] BOM in Excel Format (PDF provided is unusable)

[ ] Pick & Place (XY) File

[ ] Assembly Drawing (Pin 1 orientation undefined)

[ ] Programming File (.hex/.bin)

Please upload missing files by [Date/Time] to maintain schedule.

Recap: RFQ Intake Checklist & Golden Data Pack

Parameter	Requirement	Format / Criteria	Action on Non-Compliance
Bill of Materials (BOM)	Machine-readable, complete data.	XLS/CSV only. MPN for critical ICs/connectors. Case/Value/Tolerance/Voltage for generics. “No Substitutes” or “Alternates Allowed” flagged.	Reject PDF/image. Pause quoting.
PCB Assembly Data	Complete coordinate & orientation data.	ODB++ preferred. Gerber RS-274X + separate XY file (RefDes, X, Y, Rotation, Side). Drill chart for blind/buried vias.	Request missing XY file.
Component Orientation	Unambiguous polarity definition.	Assembly drawing required for polarized components (Pin 1/cathode). Do not rely on silkscreen. DNP RefDes identified.	Request assembly drawing.
Revision Control	Document version synchronization.	BOM revision must match PCB revision.	Hard stop on mismatch. Confirm intent formally.
Test & Programming	Complete firmware & test protocol.	.hex/.bin file + checksum + voltage for MCU. Test spec with Input/Output/Pass-Fail limits for ICT/FCT.	Request missing firmware or test spec.