4.4 Programming & Tuning
ProgrammingInspection programming translates raw component and solder data into actionable pass/fail judgments. The primary operational goal of tuning inspection is whereto rawminimize machinethe capabilityFalse turnsAlarm intoRate reliablewhile judgment.ensuring zero escapes (False Negatives). This requires a structured approach based on Golden samplesSamples, disciplined Library Management, and disciplinedcontinuous libraries create a stable foundation, while risk-based limits ensure the system focuses on what truly matters—catching escapes without drowning in cosmetic noise. Iterative feedback,iteration driven by Pareto analysis,Analysis keepsof false callscalls. under control and makes tuning a structured process instead of a guessing game. Most importantly, inspectionInspection programs are not substitutesa substitute for process control; they actfunction as a highly sensitive indicatorsprocess monitor that point back toflags upstream drift in printing andor reflow when patterns emerge.placement.
4.4.1 WhatThe “programmingInspection &System tuning”Programming really meansLoop
You’reProgramming turningand tuning transform static design data into a robust, repeatable inspection judgment. This judgment must be consistent across shifts and operators.
- Data Import: CAD/Gerber data (centroid location, polarity, component shape) is imported and mapped to the machine's library.
- Teaching and Calibration: The machine is physically taught using the Golden Board
into(Chaptera2.5) to establish optimalrepeatablelightingjudgment. That’s:good lighting/slices, 2) lean, reusablelibrary items, 3) sanelimitsper risk class, and 4) afeedback loopthat trims false calls without letting escapes slip through.
4.4.2 Build the right golden set (don’t teach from randoms)Golden boardprofiles (doAOI)not ship): known-good after AOI/AXI/ICT/FCT.Near-limit board: same build, but with “barely OK” features (smallest fillets, highest allowed voids). Teaches the tool whatandstillslicepassesplanes (AXI/Laminography).Bad examples packTuning::croppedThresholdsimagesand inspection criteria are iteratively adjusted to balance the detection capability against the operational cost ofrealmanual verification.
Mandate: The inspection program's success is measured not only by the defects (bridges,it tombstones,catches HIP,but void clusters) labeledalso by type.
4.4.2 Library and Data Standardization
A standardized library is essential for rapid changeovers and high throughput across multiple products.
- One Package, One Library: A single library item should be created for each unique component package (e.g., 0402, 0.5 mm QFN). This item defines the Presence Window,
AXIPolarityslice heights/ROIs, and a one-pager ofacceptance limitswith each product rev.
4.4.3 Library discipline (the stuff that scales)
One package = one library item, reused across products; keep per-finish lighting variants if needed (e.g., ENIG vs OSP).For AOI items: definepresence window,pin-1/polarity regionRegion, andpadSolderROIsPad ROI (solderRegionchecks).ofAvoidInterest)usingforlogos/lot text as truth.inspection.- Reusability: Library items must be reused across all product programs to ensure consistency and minimize programming time for new products (NPI).
- AXI Specifics: For
AXIAXI,items:the library item must lock parameters such as ballcount/pitchpitch, component height, slice plane locations (Laminography),,slice plane(s),andvoid %voiding rules (per ballvsvs.total)total area). NamingGolden Set::The program must be built using data derived from the Golden Board<Pkg>_<Pitch/Size>_<Finishif(known-goodspecial>_v#after FA) and, ideally, supplemented with Near-Limit Boards (assemblies with barely acceptable features) to teach the system what still passes.No “temp_final_new2”.
4.4.43 Risk classesClassification &and Limit Setting
Not all defects are equal. Inspection limits must be tailored to the risk level to prevent cosmetic issues from blocking critical high-reliability production (soWIP).
Risk | Defect | Limit | Action upon Failure |
Class A ( | Missing | Tight Limits. | Must |
Class B ( | Tombstoning, Insufficient Fillet, Minor Skew. | Moderately Wide Limits. | Used |
Class C ( | Smudges, Silk Screen Nicks, Flux Residue. | Chart Only. |
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4.4.4 Tuning and the classFalse onCall everyReduction rule.Loop
Tuning inis doubt,the promotecontinuous process of adjusting parameters to areduce stricterFalse classCalls for(False NPI,Positives) thenwithout relaxintroducing afterEscapes (False Negatives). This must be driven by data.
4.4.5 The fast iteration loop (Pareto → change → recheck)
Run 50–200 boards, then:
- Pareto
false callsAnalysis:byRunrefdesa&samplereason,lot (50–200 boards) and generate aseparatePareto chartfromoftruealldefects.false calls, classified by component reference designator (RefDes) and specific failure reason (e.g., "U10 fillet too reflective"). - Iterative Fixes:
FixAddress the top 3 false-call sources with the smallest possible change (e.g., adjust a single lightinggain,angle,ROIslightlysize,widen onethresholdcomponent'snotch)acceptable X/Y window). Avoid globalrelax.threshold relaxation. - Verification: Re-run a small mini-lot (10 boards)
→to confirm the falsecallscalldroprate drops andescapesthatstaytheflat.detection of true defects remains intact. - Process vs. Program:
Version-bumptheIfprogram;tuningaddcannot resolve a1-line “why” in the changelog.
Repeat weekly untilconsistent false calls settle under your targetcall (e.g., ≤0.5–1.0/board)recurring Insufficient Solder calls on a specific component), thenthe switchissue is likely Process Drift (low SPI volume, poor paste release) and must be referred to monthlyManufacturing trims.
4.4.6 When to touch process, not code
Use inspection asfor a thermometerstencil or printer recipe fix, not(Chapter a1.5).
4.4.5 Change Control and Program Maintenance
Inspection programs must be treated with the same change control rigor as PnP programs (Chapter 2.2).
BridgingVersioncallsControl:clusterThe→AOI/AXIcheckprogram revision must increment with any change to the libraries, limits, or algorithm settings. The program version is tied directly to the product'sSPIGoldenarea/cleaningandseparationRecipe (7.Chapter 2.5)before widening AOI thresholds..BGA voidsDocumentation:highEveryacrossprogram change must include alotone-line→explanationrevisitinQFN/BGAawindowingchangelog (7.4) orsoak/TAL(9.2)e.g.,not"v2.1:AXIReducedlimits.false bridge calls on C47-C49 by softening lighting angle per QE approval").TombstonesMachine Learning (ML):→ re-balance chip apertures (7.4) and confirm ramp rate (9.1).
If the Paretosystem smellsuses likeML/AI afor processdefect drift, fixclassification, the linetraining set must be diverse, and keep inspection tight.
4.4.7 ML/auto-learn without regret
Train ondiverselots (mask colors, finishes, vendors).Keepa holdout set(neveroftrainedimageson)must be reserved forspotregular,checksindependenteveryverificationrev.of the model's accuracy.
Final Checklist: Inspection Program Health
Action | Control Point | Responsibility |
Library Management |
| AOI/AXI Programmer |
False Call Control | False call rate is measured weekly and falls below the | Quality |
Process | False | Process |
Recipe |
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