5.5 Data Logging & Repair Tickets

Data logging and repairthe ticketsformal Repair Ticket system are the nervous system of modern electronics manufacturing,manufacturing. turningThey transform every failuresingle failure—from a component polarity error to an intermittent power fault—into structuredstructured, informationactionable thatinformation. canThis besystem actedensures upon.containment Instead(stopping the flow of vanishingbad intoparts), stickysafe notesrework, orand, informalmost fixes,critically, eachfuels the Corrective and Preventive Action (CAPA) loop by providing accurate, traceable data on defect issource, captured with full traceability—serial numbers, defect codes, images,source, and processfrequency.

context—so

5.5.1 noThe issueTraceability getsCore: lost.Locking Repair flows, MRB decisions, and CAPA actions all draw fromDown the sameFailure records,Context

ensuring

When consistenta containment,board safefails rework,at andany data-driveninspection prevention.point With(SPI, thisAOI, discipline,ICT, FCT), the factoryManufacturing notExecution onlySystem repairs(MES) boardsmust efficientlyinstantly butgenerate alsoa learnsRepair fromTicket. eachThis ticket serves as the board's permanent genealogy record throughout its repair journey.

Data Record Mandates (What to Capture Every Time)

Your system must automatically capture these data fields upon failure to reduceenable recurrencerapid diagnosis and cost.root

5.5.1cause What “good” looks like (one page)

A fail becomes a ticket in seconds—auto-filled with facts (who/what/when/where/how). The board is quarantined by ID, the right people get pinged, repair techs follow a standard work recipe, retest proves the fix, and the data flows into Pareto and CAPA without copy-paste. No sticky notes. No mystery boards.analysis:

Category	Essential Data Points	Purpose 5.5.2 The record you must capture (every time) Make tickets boringly complete. Your MES/traceability system should auto-populate most fields:
Identity & contextContext	Board Serial Number / Panel ID / Work Order Product/Rev(SN), Panel ID, Work Order, Product/BOM Rev,Revision, ECN (if in effect) Station (SPI/AOI/AXI/ICT/FCT), recipe rev, line/machineMachine ID Date/time,.	Ensures 100% traceability from start to finish.operator/tech badge
Failure detailDetail	Defect codeCode (from a controlled list), Refdes / RefDes/Location (X/Y if available) Side (Top/Bottom)coordinates), layerStation (if via/PTH) Evidence:, Date/Time.	Pinpoints the failure location and the last working point on the line.
Evidence & Process	Attached SPI/AOI/AXI images, reflow profile plotImages, ICT/FCT measurementsMeasured Values, Recipe Revision (Printer/Oven/PnP).	Provides forensic proof and links the failure to the process settings used.
Materials hooksHook	Solder StencilPaste Lot ID, pasteComponent lotLot/Date Code, component lot/date code, feederFeeder ID, fixtureFixture ID Optional:.	Enables targeted quarantine and supplier quality investigations (SCAR).

5.5.2 Defect Codes and Rework Discipline

Defect codes must be a controlled vocabulary that links the observed fault to the likely reelroot spliceprocess owner, not just the symptom.

A) Defect Coding (Source-Focused)

Codes should be simple (e.g., 15–25 timestamp,codes max) and directly translatable into a process action. For instance, a code like program revBRIDGE-FP (PnP)Fine-Pitch Bridge) points to the Printing team (Stencil/Setup), while POWER-RAIL-LOW points to the Test/Design team. Codes must never be "Other/Miscellaneous."

B) Rework and Verification

A board entering the repair loop must follow a strict, auditable path to ensure the fix is safe and effective:

1. Quarantine: The failed board is immediately routed to a designated NG (No Good) area and logged as quarantined.
2. Standard Work: The repair technician must open a Work Instruction (WI) tied to the defect code, detailing the required tools, temperatures, and maximum rework cycles allowed for that component (e.g., BGA ≤ 2 reflow attempts).
3. Retest: The repaired board must be verified by running it through the same test station (ICT or FCT) that originally flagged the failure. "Looks good" is not a valid result.
4. Genealogy Update: If a component (e.g., a BGA or IC) is replaced, the ticket must be updated with the new part's lot/date code to maintain complete product genealogy.

5.5.3 MRB and the CAPA Loop

The true value of the logging system is realized when repeat failures are escalated for permanent correction via the RoutingMaterial Review Board (MRB) and CAPA.

A) MRB and Disposition

The MRB (Quality, Engineering, Materials) reviews non-conforming material to assign a final disposition based on risk, cost, and safety:

• Containment stateRework: (QuarantineStandard →fix Reworkapplied →and MRB)verified).
• DispositionScrap: (ReworkUnrepairable; /the ScrapCoPQ /hit Use-as-is / RTV to supplier)recorded).
• Repair actionUse-as-is: (WIsRisk used,is partsdocumented replaced)and waived; customer approval often required).
• RTV (Return to Vendor): (Component/material issue; triggers a SCAR—Supplier Corrective Action Request).

B) CAPA and Effectiveness

A sustained or critical failure must trigger a CAPA (often structured as an 8D report). The ticket data provides the evidence for containment and root cause.

• Trigger: CAPA is initiated when the defect rate exceeds a predetermined threshold (e.g., >0.5% recurrence over 3 lots) or involves a high-risk failure mode (e.g., BGA-HIP).
• techRoot Cause:, Use tools like ret5-Why Analysis or Fishbone Diagrams to trace the fault from the test resultstation back to the process (e.g., FCT power failure – ICT miss – SPI volume low – Clogged stencil aperture).
• Effectiveness Check: The CAPA closure cannot rely on simple sign-off. The system must define a metric (e.g., "Reduce BRIDGE-FP to ≤ 0.1% for the next 4 production lots") and verify that the metric is sustained over time.

If

Final yourChecklist: software can’t store attachments, fix the software. PicturesRepair and plotsCAPA end debates.

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5.5.3 Defect codes that drive action (keep it small)Discipline

Start with 15–25 codes, not 200. Codes should point to a process knob.

FamilyStage / Action	CodeMandate / Verification Point	WhatKey itPerformance means	FirstIndicator owner(KPI)
PrintLogging	PVL-LOWEvery /board PVL-HIGHfailure auto-generates a ticket with SN, Defect Code, and Process Evidence (e.g., AOI image).	Aging TicketsSPI volume(must outbe ofclosed band	Printingwithin team24/48 hours).
ReflowRework	BGA-HIP	Head-in-pillow	Process/oven
	QFN-VOID	ThermalRework voidstechnicians overmust limit	Process/oven
Placement	ORIENT	Polarity/pin-1 error	PnP/DFx
Assembly	BRIDGE-FP	Fine-pitch bridge	Stencil/print
Materials	COMP-BADLOT	Component lot suspect	SQE/Supplier
Test	ICT-OPEN / ICT-SHORT	Structural fault	DFT/ICT
Functional	FCT-COMMS / POWER	Interface/power fail	Test Eng
Damage	MECH-CRACK / ESD	Handling/ESD	Ops/QE

Never put “Other” without a free-text note. Free-text alone is how problems hide.

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5.5.4 Flow that never loses a board (golden path)

1. Fail at station → Auto-ticket. MES locks thefollow panel/SN;Standard NG diverter sends it to quarantine.
2. Triage (cell lead/QE): confirm code, attach evidence, choose Rework vs MRB.
3. Rework (if reversible): tech opens standard work (WI) by code, performs fix, logs parts used and cycles.
4. Verify: required re-inspection/re-test in the same station that failed plus any downstream gates affected. No bypass.
5. Close: ticket gets root cause (5-Why field), action taken, and sign-off.
6. MRB (if not reworkable/suspicious): board, parts, and paperwork to Material Review Board for disposition (Scrap / Use-as-is / RTV).
7. CAPA (for recurring/critical): open 8D; assign owner, due dates, and effectiveness check.

House rule: a board cannot leave repair without passing the failing step again. “Looks good” isn’t a result.

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5.5.5 Rework discipline (fast, safe, repeatable)

• ESD controls on every bench; log strap tests.
• Work Instructions (WIs) perand code:log tools,all temps,parts nozzle sizes, paste/flux, maxand heat cycles.
• Rework limits per part: e.g., BGA ≤ 2 reflows, 0402 ≤ 3 touch-ups—ticket must count attempts.
• Verification: AXI after BGA/QFN work; AOI for fine-pitch; ICT/FCT for electricals; update genealogy if parts replaced (lot/date link).

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5.5.6 MRB & dispositions (decide once, apply always)

MRB = QE + PE/ME + Materials/SQE + sometimes Design. Inputs: ticket, evidence, cost, risk.

• Rework (safe/standardized)
• Use-as-is (documented risk; customer waiver if needed)
• Scrap (record CoPQ hit)
• RTV (Return to Vendor) with photos, fail data, and lot trace → start SCAR (supplier CAPA)

MRB outcomes should update AVL status or process settings when patterns appear.

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5.5.7 CAPA that actually closes

• Trigger: threshold on a code (e.g., >0.5% of boards for 2 days, or any safety/field risk).
• 8D skeleton in the system: D1 team, D2 problem statement, D3 containment, D4 root cause (5-Why/Fishbone), D5 corrective, D6 preventive, D7 effectiveness, D8 closure.
• Effectiveness: define the metric up front (e.g., BRIDGE-FP ≤ 0.1% for 4 lots) and check after release. No metric = no closure.
  

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5.5.8 Metrics to run the floor (and reviews)

• MTTR (meanMean timeTime toTo repair)Repair) by code/stationdefect code;
• Repeat-Fail Rate (same SN, same code)fault).

• Verification

  Repaired boards must pass the failing test step again (no bypasses).

  100% Retest completion rate logged in the MES.

  MRB

  Final disposition (Scrap/Rework/Use-as-is) is decided by the MRB based on risk and CoPQ.

  Disposition Mix (Scrap rate trend); CoPQ (Cost of Poor Quality) total.

  CAPA Loop

  Recurring/critical failures must open a CAPA with a measurable Effectiveness Metric.

  Top-10 Pareto (lastdefect 7/30frequency; days)

• AgingCAPA ticketsClosure Rate (openwith >24/48verified h)
• Disposition mix (Rework/Scrap/RTV/Use-as-is)
• DPPM by source (Process / Materials / Design / Test)
• Cost of Poor Quality (CoPQ) = Scrap + Rework labor + Parts + RTV costs
• Supplier score: defects per lot, SCAR on-time closure

Weekly ops/QE look at Pareto + MTTR; monthly MRB/CAPA review checks effectiveness and CoPQ trend.effectiveness).

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5.5.9 Glue to upstream & downstream (close the loop)

• Upstream: recurring BRIDGE-FP → stencil/aperture change (7.4) and printer setup (7.5); BGA-HIP → profile/TAL + N₂ (8.x); COMP-BADLOT → SQE + incoming screens (6.5).
• Downstream: FCT fails feed back to ICT/BSCAN adds (11.1–11.3) or firmware self-tests; RMA field returns enter the same code system so factory and field speak one language.
  

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5.5.10 Pocket checklists

At the station (operator)

• Ticket popped with SN; evidence attached (image/plot/data)
• Board quarantined (NG lane / rack); no pass-around
• Correct defect code selected; free-text note if edge case

At repair (tech)

• ESD check OK; WI opened for this code
• Parts/flux/temps logged; rework attempt count updated
• Required re-inspection/re-test passed; genealogy updated if parts swapped

At MRB/CAPA (QE/PE/SQE)

• Disposition chosen with data; CoPQ recorded
• Supplier notified (if RTV) with full pack of evidence
• CAPA opened if threshold hit; metric for effectiveness defined
• Dashboard reflects change; “why” written in release notes
  

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A robust ticketing and repair system ensures defects are contained, fixes are verified, and root causes are closed with measurable effectiveness. This strengthens both immediate yield and long-term reliability, while keeping teams aligned around clear, factual data.