Part 3. Cleaning, Depanelization, Press-Fit, Conformal Coating/Potting

Your product's long-term lifespan is decided after soldering. This chapter shows how to achieve true environmental durability and mitigate failure risk in the final assembly stages.

We secure the board's integrity by mastering:

• Cleanliness: The critical Clean vs. No-Clean decision to eliminate flux residue and prevent latent electrical failures.
• Mechanical Assembly: Controlled depanelization and press-fit techniques to prevent mechanical stress.
• Protection: Applying coating or potting — the final physical shield — to defend against moisture and vibration.

Ensure your product doesn't fail prematurely in the field.