3.3 Soldered and Ultrasonic Terminations
EnvironmentalWhile crimping is the standard for high-volume termination, soldering and lifeultrasonic testingwelding turnsare mandatory for specific high-reliability or high-current applications. These processes create a wiremetallurgical harnessbond fromrather than a lab-builtmechanical assemblyone. intoHowever, athey provenintroduce fieldthermal survivor.variables By— exposingheat, samplesflow, and solidification—that mechanical crimping does not. Controlling these thermodynamics is essential to bending,prevent vibration,brittle heat,joints, humidity,insulation melt-back, and corrosivelatent agents,failures thesecaused testsby uncover the weaknesses that only appear after long use or harsh conditions. Running electrical checks before and after each stress cycle ensures that performance, insulation, and contact integrity remain intact. The process transforms durability from an assumption into measurable proof, tailored to the product’s real operating environment.wicking.
3.3.1 WhatSolder thisCups: provesThe Manual Interface
Solder cup terminations are common in military (MIL-DTL) and Solder Cup Fill Wicking Limit Ultrasonic Weld Seal Integrity Tubing Quality Splice Positionwhenheavy toindustrial run it)
connector Design/qualification: “Will this harness survive its world?” Run at NPI or when materials change (wire, boots, backshells, overmold).connectors.Process monitoring: “Are builds consistent?” Run smaller samples perUnlike quarterPCB or per vendor shift (sleeve, resin, contacts).Failure analysis: reproducesoldering, the customer’sheat environmentsource tois seemanual, and the breakthermal andmass fixof the mechanism.Alwayscup bookendis exposures with electrical checks: Continuity → Resistance (Kelvin on power) → IR → Hipot (3.1), plus visuals.significant.A)
Process Mandates
3.3.2Pre-Tinning: TestThe planningwire strand end must be pre-tinned (foursolidified) decisionsbefore first)insertion. Inserting loose strands invites splaying and poor wetting inside the cup.
SpecimensThermal Transfer:: exactThe PN–Rev–Variant;iron routetip themmust heat the cup, not just the wire. Solder is fed into the cup to form a molten pool before the wire is fully seated.B) Workmanship Standards (IPC/WHMA-A-620)
a board to final install clamp spacing and bend radiiClass).Instrumentation:Fill continuity glitch monitor (≥1 kHz), Kelvin taps on power/grounds, thermocouplesLevel: onSolder suspectshould joints.be visible at the cup entry.SuccessClass criteria3:: defineSolder must follow the contour of the cup entry. limits up front (drops, ΔR, ΔT, IR/Hipot, cosmetic).SequenceOverfilling (typical):spillage onto the outside of the cup) is a Defect.Baselineshrink sleeving →is Flex/Torsionmandatory →to Vibrationprovide →strain Temp/Humidityrelief cyclesand →insulation Chemical/Ingresssupport (ifimmediately relevant)behind →the Final electrical.cup.3.3.2 Splices: Ultrasonic vs. Crimp
KeepSplicing onejoins unittwo asor more wires into a controlsingle (noelectrical exposure) to compare drifts.node.A)
Welding3.3.3Ultrasonic Flex & bend cycling (where most field issues start)SetupsMandrelwelding bend:uses wraphigh-frequency overmechanical vibration to scrub metal surfaces together, creating a radiussolid-state =metallurgical design minimumbond (static:cold ≥6×weld) OD;without dynamic:adding ≥10× OD unless high-flex cable).Rolling flex / drag-chain: for motion-class cables.Torsion: clamp ends; twist ±90–180° about axis.
Starter profiles (tune to product)
Monitor & limits
Continuity glitches >1 ms = fail; ≤3 blips <1 ms allowed (log).ΔR end-to-end ≤ 10–20% vs baseline (Kelvin on power).No jacket cracks, sleeve retreat,solder or shieldcrimp breakouts.
3.3.4 Vibration (find loose pins, fretting, bad clamps)
Replicate the installed clamp scheme on the shaker; first clamp before first bend.
Screening sweep (find resonances)
Sine 5→200 Hz, 0.5 g, 2 oct/min, 3 axes; dwell 1 min at peaks if needed.
Random vibration starter (industrial)
10–500 Hz, overall 3–5 grms, 3 axes, 30–60 min/axis (tune to product/vehicle spec if provided).
Pass indicators
0 continuity opens >1 ms during any axis.No bent/broken contacts or backshell loosening.Post-test IR ≥ limit and Hipot PASS (21.1).
3.3.5 Temperature cycling & thermal shock
Temperature cycling (air-to-air)
Range: −40 → +85 °C (or your product limits), ramp ≤ 5 °C/min, dwell 30 min at extremes, 50–100 cycles.Monitor continuity at extremes if possible.
Thermal shock (two-chamber)
−40 ↔ +85/105 °C, transfer ≤ 30 s, dwell 10–15 min, 50–100 cycles.
Pass
No cracks in boots/overmolds, label legible, ΔR ≤ 10–20%, IR/Hipot PASS.Shield bonds intact (< 0.1 Ω end-to-end or to chassis point).
3.3.6 Humidity & moisture
Insulation resistance loves to fall when wet. Prove your materials.
Damp heat steady state (starter)
40 °C / 95% RH, 96 h; unpowered, then 1 h dry at room conditions → run IR/Hipot.
Damp heat severe (materials-permitting)
85 °C / 85% RH, 168–500 h (verify jacket/adhesive ratings first).Acceptance: IR ≥ 10–100 MΩ (per product), boots/labels still adhered, no green corrosion.
3.3.7 Chemicals, UV, salt fog (if the environment demands it)
Chemical splash/soak
Fluids: oil/coolant/IPA/brake fluid/cleaners from your use-case.Method: 24–72 h soak or periodic splash at room temp; then flex 2k cycles on mandrel.Pass: no swelling >10%, no softening/cracks, labels legible, IR/Hipot PASS.
UV/outdoor
UV exposure (lamp/arc) ≥ 100 h; then bend test. Pass = no embrittlement/cracking; print still readable.
Salt fog
5% NaCl, 35 °C, 48–96 h; focus on backshells/lugs. Pass = no red rust on stainless, minor cosmetic only on plated, continuity unchanged.
3.3.8 Ingress (IP) & washdowns
IP54 spray: multi-angle spray 5–10 min; IR/Hipot afterward.IP67 dunk: 1 m / 30 min with mated seals; look for bubbles; post IR/Hipot.Washdown: if applicable, run spray with detergent and relabel legibility check.
3.3.9 Mate/unmate life & latch strength
Cycle per expected service.
Mating cycles
50–100 cycles for general purpose; ≥500 if field-serviceable.Track contact resistance (per pin) every 25 cycles; drift ≤ 50 mΩ from baseline.
Latch/CPA pull
Pull at rated direction; latch must hold ≥ spec without damage; visual OK after test.
3.3.10 What to record (tie to SN, not a notebook)
Profile IDs (flex/vibe/temp), dates, operator, fixture IDs.Baseline and post-exposure: Continuity/shorts, Kelvin R, IR/Hipot, shield bond Ω, photos.Real-time: glitch timestamps, ΔT at connectors, resonance notes.Disposition (PASS/REWORK/FAIL) with mechanism if failed (e.g., “shield wire break at bend after 12k cycles”).
Store with the harness SN (20.5) so RMAs find it in seconds.barrels.
3.3.11 Starter acceptance table (tune to your spec)
A) Material Selection
B) Application and Inspection
3.3.12Final CommonChecklist: trapsSoldered →and smallestSealed reliable fixTerminationsTrapMandateSymptomCriteriaFixVerification ActionTestingSolder visible at the entry, fully wetting cup and wire; no spillage on “freethe cable”exterior.UnrealisticVisual failuresWrongSolder radiuswicking inmust flexstop testbefore the wire enters the strain relief zone.EarlyTactile breaksNoWeld glitchnugget monitormust meet Height and Energy targets.IntermittentsMachine unseenHipotDual-wall rightheat aftershrink humiditymust show a visible ring of adhesive at both ends.FalseVisual failsOvercookingNo heat-shrinkcharring, inburning, cyclesor splitting of heat shrink.BrittleVerify stiffheat zonesGenericSplices chemicalsmust be staggered in the harness to prevent a large "snake swallow" bulge.PassDimensional incheck lab, fail in field
3.3.13 Pocket checklists
Setup
Specimens PN–Rev–Variant; board-mounted with real clamp spacingTC and Kelvin leads on suspect points; glitch logger armedSuccess limits posted; control unit set aside
Run
Flex/drag-chain to target cycles; log glitches/ΔRVib: sine sweep then random 3 axes; no opens >1 msTemp/humidity per profile; stabilize before electrical retestChemical/UV/salt/IP as required
Closeout
Post-test Continuity, Kelvin R, IR, Hipot recordedVisuals & photos (boots, labels, overmold, shields)Failures tagged with mechanism; samples archived
When harnesses are qualified under controlled environmental stresses and results are logged with traceable detail, reliability is no longer left to chance. The outcome is fewer failures in service, stronger confidence in design choices, and production that delivers durability as a standard feature.