8.3 Root Cause Analysis (RCA) & CAPA
If you are fighting the same fire this week that you fought last month, your CAPA system is broken. Root Cause Analysis (RCA) is the difference between "fixing" a problem and "solving" it. Most organizations stop at the symptom ("Operator error"); true engineering discipline drills down to the systemic failure ("Why did the system allow the error?"). This chapter defines the logic required to permanently kill a defect.
The RCA Mindset: Blame vs. Physics
The managementfirst rule of Non-ConformingRCA Materialis: (NCM)You andcannot fire your way to quality. If you blame the Corrective and Preventive Actionoperator (CAPA)"Man"), systemyou formhave failed the "immuneinvestigation. system"Humans ofare variable; processes must be robust.
The Investigation Hierarchy:
- Physics First: Did the
factory.machine or material fail? - Process Second: Did the method allow variation?
- People Last: Did the operator willfully violate a clear, physically possible instruction?
The 5 Whys (Drilling for Oil)
Do not stop at the first "Why." The first answer is usually a symptom. The fifth answer is the root cause.
Example: Solder Short on U12
- Why 1: Solder bridged two pins. (Symptom)
- Why 2: Too much solder paste deposited. (Direct Cause)
- Why 3: The stencil aperture was too large. (Process Cause)
- Why 4: The stencil design followed the pad 1:1 without reduction. (Design Cause)
- Why 5: The DFM Guideline for 0.4mm pitch components was outdated. (Systemic Root Cause)
Action: Update the DFM Guideline. Just cleaning the board (Correction) ensures the problem will happen again tomorrow.
The Fishbone (Ishikawa) DiagramLogic
When a defect occurs,Use the investigation"6Ms" mustto structure your brainstorming. If you don't look at sixall distinct6, categoriesyou ("Thewill 6 Ms") to avoid blamingmiss the operator.interaction variables.
Man (People):Man: Training,fatigue.fatigue, visual acuity.- Machine: Calibration, wear,
settings.settings, maintenance. - Material:
ComponentVendorvendors,changes, shelflife.life, moisture content. - Method:
WorkSOPinstructions,clarity,routing.sequence, tooling. - Measurement: Gauge
error,R&R,lighting.lighting, parallax error. - Mother
Nature (Environment):Nature:Humidity,Humiditytemperature.(ESD/MSD), temperature drift.
Pro-Tip: If your Root Cause is "Operator Training," I demand to see the "Method" analysis. Training cannot fix a process that requires superhuman attention span.
TheCAPA: 5Correction Whysvs. Corrective Action
Drill down from the symptom to the systemic root cause.
Problem:Solder bridge.Why?Paste volume too high.Why?Stencil aperture too large.Why?Designed 1:1 with pad.Why (Root)?DFM Guidelines didDo notspecifyconfuseaperturethesereductionterms.forTheythisarepitch.
distinct in an audit.
CAPACorrection (CorrectiveThe & Preventive Action)Band-Aid):
Correction:Definition:FixImmediatetheactionimmediatetoproblem (rework).Corrective Action:Eliminatefix therootnon-conformance.- Example: Reworking the solder bridge.
- Result: The product is good, but the risk remains.
Corrective Action (The Cure):
- Definition: Action to eliminate the cause
to prevent recurrence (fixof thestencil).non-conformance. Verification of Effectiveness:Example:AuditRedesigning theprocessstencil30-60aperture.- Result:
daysThelater.defectIfcan never physically happen again.
Preventive Action (The Vaccine):
- Definition: Action to eliminate a potential cause in other products.
- Example: Applying the
problemnewreturned,aperturethedesignCAPArulefailed.to all future PCB layouts.
Final Checklist
| Critical Requirement | Risk Avoided |
Depth | Drill down to System/Process level, not "Human Error." | Recurrent Failures |
Evidence | Root cause must be able to turn the problem On and Off (simulation). | Guesswork |
Action | CAPA must include | |
| ||
Verification | Audit effectiveness 30- |
|
Scope | Apply "Preventive Action" to similar product families. | Cross-Product Contamination |