8.9 Counterfeit Avoidance (AS5553)

Counterfeit components represent one of the highest risks in electronics manufacturing, undermining both product reliability and traceability. They can look convincing yet hide re-marked, re-balled, or aged parts that fail catastrophically. The global supply chaindefense is vulnerablea tostructured counterfeitsystem components—reclaimed,that remarked,begins orat fakeprocurement parts.and ensures every part is traceable and verified.

1.33.1 Sourcing Control: The Ladder of Trust and CoC

Counterfeit avoidance starts by building a SAESupply AS5553Chain Firewall providesthrough policy and documentation, minimizing the frameworkentry points for avoidance,suspect detection,material.

mitigation,

The Ladder of Trust

Sourcing decisions must follow a hierarchy based on traceability and disposition.accountability:

8.9.1 Prevention Strategy

1. Procurement:OCM Direct (Best): Purchase exclusively from OCMs (Original Component Manufacturers)Manufacturer. or Authorized (Franchised) Distributors.
2. Chain of Custody: Manufacturers must maintainProvides full traceability documentsand control.
2. Authorized/Franchised Distributor: Listed by the OCM. Passes the OCM's certificate and warranty through.
3. Independent/Broker (Last Resort): Only used if the part is allocated or obsolete, and only with a formal approved deviation, customer notification, and a mandatory elevated screening plan.

Certificate of Conformance (CoC)

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The CoC is the material's identity document and must be verified against the physical part at receiving.

• Mandatory CoC Fields: A valid CoC must clearly state the OCM Name, OCM Part Number, Lot/Date code, Quantity, and Country of Origin. It must show a clear trace to the OCM.OCM shipment or authorized distributor ID.
• Document Linkage: The original CoC must be digitally attached to the UID created at receiving for permanent audit readiness.
• CoC Red Flags: Look for photocopied logos, typos, mismatched country/labeling, or generic "open market" language.

8.9.1.33.2 DetectionRisk (TheTriage: GreyScoring Marketand Protocol)Screening Intensity

WhenSince partsyou can't test every part, screening efforts must be sourced from independent brokers duetied to obsolescence:a risk score assigned at procurement. This focuses resources on the most vulnerable and costly components (high-value ICs, obsolete parts, and broker buys).

Component Risk Scoring Matrix

Score each lot based on procurement data to set the minimum screening plan:

Cue	Low Risk (Visual Check Only)	Medium Risk (X-Ray/XRF)	High Risk (Decap/Electrical Test)
Source	OCM Direct	Authorized Distributor	Broker/Open Market
Lifecycle	Active / High Volume	NRND / Standard	EOL / Obsolete / Allocated
Value	Standard Passives / Hardware	Logic / Linear / < $1k Lot	ASIC / FPGA / MCU / BGAs / > $5k Lot
History	Clean Lots / Consistent Supplier	Mixed Lots / Prior SCAR	Prior Suspect Lot / Expedited > 10 x Lead Time

The Screening Toolbox

Screening intensity is dictated by the risk score:

• VisualMedium Inspection:Risk: CheckRequires forobjective sandingnon-destructive markstesting: X-ray ("blacktopping")to check die presence and bond wires), XRF (to verify lead finish composition and RoHS compliance), and a sample solderability test (J-STD-002 style).
• High Risk: Requires destructive testing on a sample basis: Electrical parametric test to datasheet, and potentially Decapsulation (acid etching) to compare the die marking/logo against known-good exemplars.

1.33.3 Detection and Quarantine Protocol

The receiving dock is the final physical barrier. Operators must be trained to recognize and immediately stop material based on visual clues.

Receiving Red Flags (Stop and Quarantine)

If an item presents any of the following, it is immediately suspect:

• Packaging: Crooked, multiple over-stickers hiding OCM labels, fonts/logos that are slightly off, or inconsistent date codes,codes inside the same reel/tray.
• Parts: Sanded/“blacktopped” component tops (indicates re-marking), inconsistent laser etching, different mold marks in one lot, bent/buffed/non-uniform leads, or bentflux leadsresidue indicativeon of pulled"new" parts.
• Solvent Test:BGA/Leads: AcetoneMismatched wipeBGA testball tosize/color checkwithin ifa markings smeartray (indicatingindicates non-factoryre-balling), ink)or leads that look improperly buffed.

Traceability and Escalation

1. Stop: If a red flag appears, the operator must immediately quarantine the material.
2. Document: Photo the evidence (packaging, part tops, labels) and create an MRB ticket (NG-QUAR).
3. X-Ray Inspection:Trace: VerifyEnsure diethe sizeCoC, photos, and wiretest bondresults patternsare againstall abound knownto "Goldenthe Sample."UID for investigation.
4. Decapsulation:Escalate: DestructiveConfirmed removalcounterfeit ofissues must trigger a SCAR (Supplier Corrective Action Request) and lead to an AVL risk rating update for the packagesupplier. to inspectIf the siliconlot dieis markings.released (after extensive screening), mark the corresponding Work Order with "elevated risk" for easy field failure tracing.

FinalOversight Checklistand Common Traps




Control LayerTrap	Action RequiredSymptom	TriggerFirst Move (The Reliable Fix)
Sourcing"Emergency" Broker Buy	BuyWeeks onlylost fromin AVLMRB; /parts Franchisefail costly tests.	Require deviation + full screening planStandard Opsbefore the PO is placed and released.
VisualSkipping CheckSolderability Test	InspectDewetting foror sanding/remarkingopen joints in the first reflow run.	Run sample solderability testAll Brokeron Partsall aged or suspect lots before kitting.
AdvancedOver-Trusting TestLabels	X-RayComponent /is Decapsulationgenuine but the date code is wrong or parts are re-marked.	High-RiskAlways /perform Brokera Partsvisual check + one objective test (X-ray/XRF) at Medium+ risk level.
ReportingPoor Records	ReportSlow fakesfield toreturns; GIDEPaudit / ERAIfindings.	Attach CoC, photos, and test reportsConfirmed Counterfeitto the UID digitally at receipt; file everything.