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3.6 Maintenance & Calibration

03. Surface Mount Technology Part 6. Changeover and Maintenance

SMT machines require rigorous maintenance (cleaning nozzles, greasing screws). This chapter should outline the PM (Preventive Maintenance) schedule: Daily, Weekly, Monthly, Yearly.

4.4 Rework & Repair

04. Through-Hole & Mixed Technology Part 2. Manual THT & Rework (tools, tec...

A dedicated section on "The Art of Undoing." How to replace a BGA (Ball Grid Array) using hot air rework stations. How to repair a lifted pad. This requires high skill and strict process control to avoid damaging the PCB.

1.4 Ethics & Integrity

01. The Dannie Operating System Part 1. The Kernel (Philosophy & DNA)

Integrity is the bedrock of competitive trust. In the EMS industry, we exist to protect and execute our customers' vision. This requires a formal Code of Conduct and strict policies governing how we handle the sensitive data and intellectual property (IP) entr...

4.1 Recruitment and Role Definition

01. The Dannie Operating System Part 4. The Employee Lifecycle (People ...

Recruitment is the process of defining, setting, and maintaining the quality bar for all talent entering the organization. It is not merely "hiring"; it is the strategic acquisition of specific skills required to execute the manufacturing mission. The process ...

4.2 Onboarding (The "Dannie Academy")

01. The Dannie Operating System Part 4. The Employee Lifecycle (People ...

Onboarding is the critical process of transferring necessary cultural, procedural, and safety knowledge quickly and efficiently. It transforms a new hire into a productive contributor while mitigating the risks associated with untrained personnel entering a hi...

4.3 Performance & Impact

01. The Dannie Operating System Part 4. The Employee Lifecycle (People ...

Performance management must be objective, quantifiable, and tied directly to the organization's mission. It measures measurable output (what was delivered) and outcome (the impact of that delivery), rather than subjective effort or activity. A robust system em...

4.4 Career Ladders & Growth

01. The Dannie Operating System Part 4. The Employee Lifecycle (People ...

Career progression must be transparent, objective, and clearly defined. It must link individual skill acquisition to mandatory organizational requirements, such as compliance certification. Growth is not limited to vertical promotion; horizontal development (e...

4.5 Offboarding and Knowledge Transfer

01. The Dannie Operating System Part 4. The Employee Lifecycle (People ...

Offboarding is the critical process of securely separating the individual from the organization while ensuring continuity of operations, security of intellectual property, and the preservation of professional relationships. The process has two distinct mandate...

1.1 The GDP Standard: Formats, Directory & Integrity

02. Engineering Inputs & The Golden Dat... Part 1. The Golden Data Pack (GDP) Spec...

The digital handoff serves as the deterministic foundation of the manufacturing process; any ambiguity in this transmission results in stochastic outcomes on the factory floor. The Golden Data Pack (GDP) is not a loose collection of files but a frozen, version...

1.2 The Bill of Materials (BOM) & Revision Control

02. Engineering Inputs & The Golden Dat... Part 1. The Golden Data Pack (GDP) Spec...

The Bill of Materials is a relational database that drives procurement, logistics, and machine programming; it is never merely a spreadsheet. A flawed BOM is the single largest source of line-down events. This specification mandates a structure that enforces s...

2.1 Material Science, Stackups & Via Architecture

02. Engineering Inputs & The Golden Dat... Part 2. PCB Fabrication Specifications ...

The bare printed circuit board is a complex composite component that acts as the mechanical and thermal backbone of the product. Its specification must account for the harsh thermal excursions of lead-free reflow and the mechanical stresses of operation. This ...

2.2 Surface Finishes & Panelization Strategy

02. Engineering Inputs & The Golden Dat... Part 2. PCB Fabrication Specifications ...

The interface between the component and the board determines the integrity of the solder joint and the efficiency of the assembly line. Surface finish selection is a strategic trade-off between shelf life, planarity, and cost, while panelization dictates the m...

3.1 Supply Chain Inputs: Labeling & Kit Hygiene

02. Engineering Inputs & The Golden Dat... Part 3. Component Logistics & Handling

The warehouse is the first manufacturing step; logistical chaos at the receiving dock translates directly to unplanned downtime on the SMT line. Precise labeling and shortage management are not administrative suggestions but physical requirements for the opera...

3.2 Component Handling: MSL & Feeder Compatibility

02. Engineering Inputs & The Golden Dat... Part 3. Component Logistics & Handling

Electronic components are environmentally sensitive devices that require rigorous environmental controls to prevent catastrophic failure during reflow. Furthermore, the physical format of the component carrier determines whether the SMT machine can feed the pa...

4.1 Land Patterns, Spacing & Polarity

02. Engineering Inputs & The Golden Dat... Part 4. DFM & Assembly Specifications (...

Design for Assembly (DFA) optimizes the layout to minimize defect rates such as tombstoning, bridging, and skew. The physical footprint on the PCB must account for the wetting forces of molten solder and the placement accuracy of the machine. Land Pattern Sta...

4.2 Process Specs: Alloys, Stencils & Chemistry

02. Engineering Inputs & The Golden Dat... Part 4. DFM & Assembly Specifications (...

The chemical ecosystem of the PCBA process — solder alloy, flux, and cleaning agents — determines the long-term reliability and electrochemical stability of the product. This section defines the standard "House Process" parameters. Solder Alloy Standards SAC...

5.1. Firmware & Test Specification (DFT)

02. Engineering Inputs & The Golden Dat... Part 5. Data Validation & Handoff

A PCBA is effectively inert silicon until programmed; the definition of firmware and test access is as critical as the copper layout. This section mandates the inputs required to enable In-Circuit Test (ICT) and manufacturing provisioning. Firmware Provisioni...

5.2 The Engineering Query (EQ) & FAI Handoff

02. Engineering Inputs & The Golden Dat... Part 5. Data Validation & Handoff

The transition from "Digital" to "Physical" is gated by the Engineering Query (EQ) process and the First Article Inspection (FAI). This protocol defines the responsiveness required to maintain the production schedule and the criteria for mass production releas...

1.1 The Manufacturing Triad – OEM, EMS, and ODM

00. The Architecture of Electronics Part 1. The Industrial Ecosystem

The electronics industry is defined not by brands, but by the contractual structures that underpin them. Understanding the distinction between the architect of a product and the builder of that product is the first step in financial and operational literacy. T...

1.2 The Economics of the Open BOM

00. The Architecture of Electronics Part 1. The Industrial Ecosystem

Transparency is the only effective hedge against inefficiency in a complex supply chain. In traditional manufacturing negotiations, profit margins are often hidden within component markups, creating an adversarial relationship between client and vendor. The "O...