Skip to main content

4.5 Environmental & Burn-in Testing

Simulating real-world conditions.

Environmental and burn-in testing is a production screen that catches “infant mortality”—the early failures on the bathtub curve—before a customer ever plugs in. It isn’t design qualification; it’s a consistency check that proves the build, parts, and process are holding steady. The method is simple in spirit: run units hot, under real load, through planned power cycles (including brief “brownouts,” i.e., voltage dips), and sometimes at controlled humidity (RH = relative humidity) while they actually do work. Profiles stay light but repeatable and are tied to the SKU, so results flow into MES (manufacturing execution system) as clean data rather than hunches. With clear pass/fail limits and safe racks or chambers, burn-in turns surprises into statistics—and ships hardware that’s already had a hard day at the office.

4.5.1 Why do this?

To flush out early-life failures (Chapter 16’s bathtub curve) and prove the unit survives heat, time, and power cycling before it meets a customer. We’re not qualifying the design (16.3)—we’re screening production and validating build consistency.




4.5.2 What counts as “environmental & burn-in”

  • Thermal stress: elevated ambient, thermal cycling, controlled ramps.
  • Electrical stress: constant load, power cycling, brownout/surge profiles.
  • Humidity (if applicable): steady RH or damp heat (only if parts are rated).
  • Operational soak: exercise fans, I/O, radios, storage—work while hot.
  • (Light vibration/transport shake belongs in 21.3 for harnesses; only include if your product spec requires.)



4.5.3 Typical burn-in profiles (pick the lightest that works)

Product class

Duration

Ambient

Load profile

Extras

Consumer/office

2–4 h

40–45 °C

50–80% duty; periodic I/O poke

3–5 power cycles

Industrial indoor

4–8 h

45–55 °C

70–100% duty; PWM/relay chatter

5–10 cycles; brownout dips

Outdoor/rugged

8–24 h

55–65 °C (per spec)

Near-max duty; RF/network active

Periodic thermal ramps (±10 °C), power cycles

Compute/network

8–24 h

45–55 °C rack/flow

CPU/NET stress (≥80%); storage R/W

Throughput check each hour

Start aggressive at NPI/ECOs (100% units), then taper to sampling when FPY is stable and field data supports it.



4.5.4 Chambers, racks & fixtures (keep it safe and uniform)

  • Burn-in racks: dedicated power distribution with current limit/fusing, airflow management, cable strain relief, interlocks.
  • Chambers: uniform airflow, monitored temp (±2 °C band), dew-point control to avoid condensation (see 25.5.6).
  • Loads: electronic loads, fan trays, network generators, RF attenuators/shield box if radios run.
  • Scripts: station launches the right recipe by SKU/Variant scan—no manual tweaks.



4.5.5 What to monitor (and how to decide pass/fail)

Log to MES by unit SN at 1–60 s cadence (pick a rate that shows trends without swamping storage):

  • Power: input current & voltage, inrush peaks on each cycle.
  • Thermals: hottest sensor/heatsink ΔT; fans RPM & tach faults.
  • System health: watchdog resets, error counters, crash logs, throughput (Eth/USB), storage SMART.
  • I/O activity: periodic loopbacks, LED/display keep-alive, relay/PWM chatter.
  • Pass if:
    • No trips/resets/crash logs.
    • Currents within golden bands; no rising trend.
    • Hottest T ≤ spec − margin (set a 5–10 °C guard).
    • All scheduled checks pass on the final cycle.
  • Fail fast: any smoke/odor, repeated watchdog, fan stall, over-temp, or unplanned power draw spike.




4.5.6 Thermal cycling & humidity (do it without causing damage)

Thermal cycling (production screen)

  • Ramps ≤ 5 °C/min; dwell 10–30 min at highs/lows you can justify (not HALT extremes).
  • Cycle count: 3–10 within the burn-in window for rugged products.

Humidity (only if the design & labels allow)

  • 40 °C / 85% RH for 2–8 h as a stress screen (not qualification).
  • No condensation: keep chamber setpoint > dew point of the unit’s guts; avoid rapid door-open shocks.
  • After humidity segments, let units stabilize to room before any Hipot/IR (25.2) to avoid false fails.




4.5.7 Power cycling & brownouts (catch marginal power paths)

  • Cycle count: 5–20 over the burn-in; include cold start and hot restart.
  • Brownout dip: briefly drop input to the edge of spec (e.g., −20%) and recover; unit should not latch up or corrupt storage.
  • Inrush: capture peaks; compare to golden so swollen caps/failing soft-start stand out.




4.5.8 Safety & ESD in hot environments

  • Racks/chambers have E-stop, thermal cutouts, and door interlocks.
  • High temp reduces glove grip—use rated cable boots and strain relief.
  • Radios on? Follow RF safety and local RF rules (use shield boxes/attenuators).


4.5.9 Data & traceability (what to store)

Bind to SN:

  • Profile ID (temps, durations, ramp rates), recipe version, rack/chamber ID.
  • Time-series summaries: max current, max temp, min volt, cycle counts, fan RPM min.
  • Event logs: resets, errors, throttle events, protection trips.
  • Final PASS/FAIL and reason codes; any rework ticket ID.



4.5.10 Acceptance cues (fast table)

Area

Accept

Reject

Thermal margin

Hottest T ≤ Spec − 5–10 °C

Near/over spec; thermal throttling

Stability

Current flat or settling

Rising current trend, oscillations

Resets/errors

None

Watchdog/crash logs present

Fans

RPM within window

Stall, noisy bearings, tach error

Power cycles

All clean boots

Latch-ups, long boot drifts

Humidity (if used)

Post-soak IR/Hipot PASS

False fails from condensation; actual shorts



4.5.11 Common traps → smallest reliable fix

Trap

Symptom

First move

“Cook and hope” (no monitoring)

PASS but field returns

Log current/temps/resets; set guard bands

Over-aggressive humidity

Hipot fails, corrosion risk

Control dew point; dry to room before safety tests

Same profile for every SKU

Over/under screen

Profiles by SKU/Variant; scale load/temp

Long test on main line

Takt killer

Side loop racks; ping-pong fixtures

Manual recipe edits

Inconsistent stress

Scan-to-recipe; lock scripts; version in MES

Power cycling via mains switch

Nuisance surges

Use programmable PSU; timed sequences

Hot cables sagging

Intermittents

Strain relief; high-temp cable boots; route supports




4.5.12 Pocket checklists

Before

  • SKU/Variant scanned → correct profile loaded
  • Rack/chamber ID recorded; interlocks & E-stop OK
  • Loads/network scripts ready; fans unobstructed
  • Ambient/chamber sensors read sane; dew-point margin OK (if humidity)

Run

  • Start log: V/I/T, RPM, heartbeat up
  • Hold at temp; run I/O/throughput tasks
  • Execute power cycles & brownouts per plan
  • Watch trend tiles; fail fast on trips/resets/over-temp

After

  • Cooldown to room; post-burn-in FCT re-run
  • Safety tests (25.2) if required post-soak—after stabilization
  • Results & summaries to MES by SN; fails to NG-QUAR with reason




Bottom line: heat it, work it, and power-cycle it—with eyes on current, temperature, and resets—then recheck the basics. Use profiles scaled to the product, avoid condensation traps, and keep clean records. Done right, burn-in converts surprises into statistics—and ships quiet hardware.