1.2 RFQ Intake Checklist & Golden Data Pack

Manufacturing speed relies on data integrity. An incomplete or ambiguous RFQ package halts the New Product Introduction (NPI) process immediately. We do not guess component values or orientations; we build strictly to the "Golden Data Pack." This dataset is the immutable source of truth for the entire production lifecycle.

The Golden Data Pack: Mandatory Inputs

ListsDefine mandatorythe inputs clearly to quoteprevent engineering holds.

1. Bill of Materials (BOM)

The BOM drives procurement and launch:machine programming.

• Format: File must be machine-readable (XLS, CSV).
  • If BOM is PDF/Image -> Reject immediately. Manual transcription creates non-zero error risk.
• Manufacturer Part Numbers (MPN):
  • If component is Critical (IC, Connector) -> Define specific MPN.
  • If component is Generic (Resistor, Cap) -> Define specs: Case (0402), Value (10k), Tolerance (1%), Voltage (50V).
• Alternates Policy:
  • If strict control required -> Flag as "No Substitutes."
  • If cost optimization preferred -> Flag as "Alternates Allowed" (Engineering will validate form/fit/function).

Pro-Tip: Excel formulas often corrupt part numbers (e.g., converting part "SEPT1" to a date). Force all BOM columns to "Text" format before saving.

2. PCB Data (Gerbers & ODB++)

Fabrication and Assembly require different data sets.

• Fabrication Data: Gerber RS-274X is standard.
  • If blind/buried vias used -> Drill chart must explicitly define layer pairs.
• Assembly Data:
  • If ODB++ is available -> Use it. (Contains netlist, stackup, and XY data in one container).
  • If Gerbers only -> You must provide a separate Pick & Place (Centroid/XY) file containing: RefDes, X, Y, Rotation, Side (Top/Bot).

3. Assembly Drawings & Visuals

Data files provide coordinates; drawings provide context.

• Polarity & Orientation:
  • If polarized components (Diodes, ICs, Connectors) exist -> Drawing must clearly mark Pin 1 or Cathode.
  • Risk: Silkscreen is often covered by the component body. Do not rely on PCB ink for inspection.
• Special Instructions:
  • If components are "Do Not Populate" (DNP) -> List RefDes clearly in BOM or Drawing.

4. Test & Programming

• Microcontrollers:
  • If pre-programming required -> Provide Hex/Bin file + alternatesChecksum policy,+ Gerbers/ODB++Voltage settings.
• Functional Test:
  • If ICT/FCT required -> Provide "Test Specification Document" defining: Input Stimulus, Expected Output, Pass/Fail Limits.

5. Revision Control

• Synchronization:
  • BOM Revision must match PCB Revision.
  • If mismatch detected (e.g., drawings,BOM testRev requirements,A programming,vs. labeling/serialization,PCB revisionRev rules.B) Outputs:-> Hard Stop. Confirm intent before purchasing.

RFQ Outputs

Upon receipt, generate the following immediately.

Missing-Items Request Template

Do not write long emails. Use this standard block to request missing data.

Subject: RFQ completeness[Project checklistName] – Data Hold – Missing Critical Items

The following items are missing from the Data Pack. Quoting/Engineering is paused until received:

[ ] BOM in Excel Format (PDF provided is unusable)

[ ] Pick & Place (XY) File

[ ] Assembly Drawing (Pin 1 orientation undefined)

[ ] Programming File (.hex/.bin)

Please upload missing files by [Date/Time] to maintain schedule.

Final Checklist

Use this table to validate the Data Pack before releasing to Engineering.

Check Item	Validation Criteria	Criticality
BOM Format	Native Excel/CSV. No PDF.	BLOCKER
MPN Clarity	100% of lines have MPN or Full Spec.	High
XY Data	Present and matches BOM RefDes count.	BLOCKER
PCB Files	ODB++ or Gerbers + missing-itemsDrill requestFiles template.complete.	BLOCKER
Polarity	Diodes/ICs have unambiguous rotation marks.	High
Revision	BOM Rev matches Gerber Rev.	Medium
Alternates	Policy defined (Strict vs. Open).	Low