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4.4 Common Failure Modes and the Debug Workflow
A zero-defect manufacturing run is a theoretical ideal, not an operational reality. When a product fails, the immediate impulse is to "fix it" by randomly swapping components until the device powers on. This is "shotgun debugging," and it destroys data. Profes...
1.1 The GDP Standard: Formats, Directory & Integrity
Production failure begins with data ambiguity. If the input data is fluid, the manufacturing output will be random. The Golden Data Pack (GDP) is not a collection of email attachments or a shared folder link; it is a frozen configuration item. It represents a ...
1.2 The Bill of Materials (BOM) & Revision Control
The Bill of Materials (BOM) is not merely a purchasing list; it is the primary driver for SMT programming, supply chain logic, and cost control. In the Golden Data Pack (GDP), the BOM functions as Master Data. If the BOM is ambiguous, the production line stops...
1.3 CAD/CAM Outputs: Fabrication Package Definition
The fabrication package is the blueprint for the physical substrate. If this data is incomplete, the PCB fabricator (CAM engineer) will fill in the gaps with assumptions. Assumptions in manufacturing are the root cause of "silent failures"—boards that pass con...
1.4 Assembly Outputs: Centroid, Rotations, Polarity and Stencil Inputs
SMT programming is not an interpretative art; it is a coordinate translation task. If the input data is relative or ambiguous, the pick-and-place machine will place components sideways, reversed, or off-pad. The Assembly Output package must provide absolute co...
1.5 Release Checklist and Freeze Rules
For an EMS provider, the NPI Gate is the primary defense against liability. Once you accept a data pack and issue a "Traveler" (production routing), you own the outcome. If the input data is ambiguous and you proceed based on assumptions, any resulting scrap i...
1.6 Engineering Queries, ECO and Deviation Control
Informal agreements via instant messaging, email threads, or verbal confirmations are non-existent during a liability dispute. Ambiguity in the Golden Data Pack leads to production stops, scrap, or latent field failures. A formal Engineering Query (EQ) process...
2.1 Material Science, Stackups and Via Architecture
A printed circuit board defined solely by Gerber files is a suggestion, not a specification. Without an explicit material and stackup definition, fabrication houses will default to the lowest-cost laminate that meets the bare minimum IPC class, often resulting...
2.2 Surface Finishes and Panelization Strategy
The physical interface between the component and the PCB is defined by two factors: the planarity of the surface finish and the mechanical stability of the panel. A poor finish selection leads to wetting failures and "Black Pad" defects, while a weak panel des...
2.3 Land Patterns, Spacing and Polarity
A component footprint is not merely a drawing; it is a prediction of how molten solder will behave under surface tension. Relying on component manufacturer datasheets for land patterns often leads to manufacturing defects, as these datasheets rarely account fo...
2.4 Process Specs: Alloys, Stencils and Chemistry
Soldering is not applying conductive glue; it is a complex metallurgical process relying on phase changes and surface tension. If the chemistry is uncontrolled, the joint will fail, regardless of placement accuracy. This chapter defines the boundary between th...
2.5 Workmanship and Acceptance Criteria
Quality cannot be negotiated after the solder has cooled. Subjective terms like "good enough," "neat," or "strong" have no place in manufacturing; they are breeding grounds for disputes between the EMS provider and the client. To ensure consistent output, the ...
3.1 NPI Supply Chain: Consignment, Kitting and Attrition
NPI Supply Chain is not about moving pallets; it is about forensic auditing. In the prototype phase, materials often arrive as "Consignment" (customer-supplied), consisting of loose cut tape, non-standard labels, and last-minute BOM changes. If you feed this r...
3.2 NPI Component Handling: MSL Hygiene and Feeder Readiness
In Mass Production, components arrive in factory-sealed, vacuum-packed reels. In NPI, components arrive in cut strips, opened bags from engineering labs, or generic packaging labeled with a sharpie. This lack of pedigree creates two distinct risks: Popcorning ...
3.3 Firmware and Test Specification (DFT)
Hardware without validated firmware is strictly inert matter—silicon and copper that consumes capital but performs no function. In New Product Introduction (NPI), the synchronization of hardware assembly and software injection is the most common failure point,...
3.4 FAI Build Evidence Pack and MP Release
First Article Inspection (FAI) is the forensic audit of the manufacturing process. It does not merely prove that a product can be built; it proves that the process is robust, repeatable, and statistically capable of scaling without exponential cost growth. The...
4.1 System BOM and Mechanical BOM (MBOM)
A missing $0.02 screw stops a production line just as effectively as a missing $50.00 processor. While Engineering teams obsess over the PCBA Bill of Materials, the Mechanical BOM (MBOM) is often relegated to drawing notes or loose spreadsheets. This negligenc...
4.2 Mechanical CAD Package and Drawings
A perfect 3D model does not guarantee a perfect part. Manufacturing partners cannot inspect a physical part against a digital STEP file without explicit tolerances. The Mechanical CAD Package acts as the binding contract between Design and Factory. If a dimens...
4.3 Wiring Harness and Cable Assembly Pack
Cable assemblies are the "nervous system" of the product, yet they are frequently the most under-documented component in the BOM. A vague cable drawing leads to intermittent connections, EMI failures, and potential fire hazards. Do not treat cables as simple c...
4.4 Mechanical Assembly WI: Torque, Sealants, TIM and ESD Controls
The Box Build process is where "tribal knowledge" destroys consistency. If the assembly sequence relies on an operator remembering which screw goes where, or how much glue to apply, the product will vary with every shift change. Create a single, unified Work I...