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1.6 Engineering Queries, ECO and Deviation Control

02. Engineering Inputs & The Golden Dat... Part 1. Release Governance and Golden D...

Informal agreements via instant messaging, email threads, or verbal confirmations are non-existent during a liability dispute. Ambiguity in the Golden Data Pack leads to production stops, scrap, or latent field failures. A formal Engineering Query (EQ) process...

2.1 Material Science, Stackups and Via Architecture

02. Engineering Inputs & The Golden Dat... Part 2. Manufacturing Specifications: P...

A printed circuit board defined solely by Gerber files is a suggestion, not a specification. Without an explicit material and stackup definition, fabrication houses will default to the lowest-cost laminate that meets the bare minimum IPC class, often resulting...

2.2 Surface Finishes and Panelization Strategy

02. Engineering Inputs & The Golden Dat... Part 2. Manufacturing Specifications: P...

The physical interface between the component and the PCB is defined by two factors: the planarity of the surface finish and the mechanical stability of the panel. A poor finish selection leads to wetting failures and "Black Pad" defects, while a weak panel des...

2.3 Land Patterns, Spacing and Polarity

02. Engineering Inputs & The Golden Dat... Part 2. Manufacturing Specifications: P...

A component footprint is not merely a drawing; it is a prediction of how molten solder will behave under surface tension. Relying on component manufacturer datasheets for land patterns often leads to manufacturing defects, as these datasheets rarely account fo...

2.4 Process Specs: Alloys, Stencils and Chemistry

02. Engineering Inputs & The Golden Dat... Part 2. Manufacturing Specifications: P...

Soldering is not applying conductive glue; it is a complex metallurgical process relying on phase changes and surface tension. If the chemistry is uncontrolled, the joint will fail, regardless of placement accuracy. This chapter defines the boundary between th...

2.5 Workmanship and Acceptance Criteria

02. Engineering Inputs & The Golden Dat... Part 2. Manufacturing Specifications: P...

Quality cannot be negotiated after the solder has cooled. Subjective terms like "good enough," "neat," or "strong" have no place in manufacturing; they are breeding grounds for disputes between the EMS provider and the client. To ensure consistent output, the ...

3.1 NPI Supply Chain: Consignment, Kitting and Attrition

02. Engineering Inputs & The Golden Dat... Part 3. Process Validation & The MP Gate

NPI Supply Chain is not about moving pallets; it is about forensic auditing. In the prototype phase, materials often arrive as "Consignment" (customer-supplied), consisting of loose cut tape, non-standard labels, and last-minute BOM changes. If you feed this r...

3.2 NPI Component Handling: MSL Hygiene and Feeder Readiness

02. Engineering Inputs & The Golden Dat... Part 3. Process Validation & The MP Gate

In Mass Production, components arrive in factory-sealed, vacuum-packed reels. In NPI, components arrive in cut strips, opened bags from engineering labs, or generic packaging labeled with a sharpie. This lack of pedigree creates two distinct risks: Popcorning ...

3.3 Firmware and Test Specification (DFT)

02. Engineering Inputs & The Golden Dat... Part 3. Process Validation & The MP Gate

Hardware without validated firmware is strictly inert matter—silicon and copper that consumes capital but performs no function. In New Product Introduction (NPI), the synchronization of hardware assembly and software injection is the most common failure point,...

3.4 FAI Build Evidence Pack and MP Release

02. Engineering Inputs & The Golden Dat... Part 3. Process Validation & The MP Gate

First Article Inspection (FAI) is the forensic audit of the manufacturing process. It does not merely prove that a product can be built; it proves that the process is robust, repeatable, and statistically capable of scaling without exponential cost growth. The...

4.1 System BOM and Mechanical BOM (MBOM)

02. Engineering Inputs & The Golden Dat... Part 4. Box Build GDP and System Integr...

A missing $0.02 screw stops a production line just as effectively as a missing $50.00 processor. While Engineering teams obsess over the PCBA Bill of Materials, the Mechanical BOM (MBOM) is often relegated to drawing notes or loose spreadsheets. This negligenc...

4.2 Mechanical CAD Package and Drawings

02. Engineering Inputs & The Golden Dat... Part 4. Box Build GDP and System Integr...

A perfect 3D model does not guarantee a perfect part. Manufacturing partners cannot inspect a physical part against a digital STEP file without explicit tolerances. The Mechanical CAD Package acts as the binding contract between Design and Factory. If a dimens...

4.3 Wiring Harness and Cable Assembly Pack

02. Engineering Inputs & The Golden Dat... Part 4. Box Build GDP and System Integr...

Cable assemblies are the "nervous system" of the product, yet they are frequently the most under-documented component in the BOM. A vague cable drawing leads to intermittent connections, EMI failures, and potential fire hazards. Do not treat cables as simple c...

4.4 Mechanical Assembly WI: Torque, Sealants, TIM and ESD Controls

02. Engineering Inputs & The Golden Dat... Part 4. Box Build GDP and System Integr...

The Box Build process is where "tribal knowledge" destroys consistency. If the assembly sequence relies on an operator remembering which screw goes where, or how much glue to apply, the product will vary with every shift change. Create a single, unified Work I...

4.5 Labels, Serialization, and Regulatory Technical File

02. Engineering Inputs & The Golden Dat... Part 4. Box Build GDP and System Integr...

A label is not merely a sticker; it is the product's legal passport. A perfectly functional device will be seized by Customs or rejected by distributors if the regulatory markings are incorrect, the serial number is unreadable, or the adhesive fails. Do not tr...

4.6 System Test, Calibration, and Pack-Out Specification

02. Engineering Inputs & The Golden Dat... Part 4. Box Build GDP and System Integr...

A PCBA that passes In-Circuit Test (ICT) is not a finished product. System integration introduces unique failure modes: pinched cables, occluded microphones, thermal shutdowns, and mechanical misalignment. The System Test is the final filter before the custome...

1.1 Governance Standards: Scope, Hierarchy & Control

01. The Dannie Operating System Part 1. The Kernel

Ambiguity in organizational standards creates operational drag and inconsistent decision-making. This chapter establishes the Dannie Operating System (DOS) as the binary source code for human interaction, management logic, and corporate governance. It replaces...

1.1 Mission & Vision: Defining "From Atom to Cloud"

01. The Dannie Operating System Part 1. The Kernel

The objective of Dannie.cc is not simply to assemble electronics. It is to eliminate the friction between hardware creation and digital infrastructure. Our mandate is to bridge the "Atom" (physical reality) and the "Cloud" (digital truth) into a single, synchr...

1.2 Core Values as a Decision Framework

01. The Dannie Operating System Part 1. The Kernel

Corporate values are often platitudes. At Dannie, they are operational algorithms. They function as the source code for autonomous decision-making. When a Manager is unavailable, or when two positive outcomes conflict (e.g., Speed vs. Robustness), these four v...

1.3 One Dannie: One Company Across all Offices and Factories

01. The Dannie Operating System Part 1. The Kernel

A manufacturing company is a single organism with two states of being: the Digital (Strategy, Engineering, Sales) and the Physical (Production, Logistics, Quality). The "One Dannie" concept is the operating protocol that synchronizes these states. It is not a...