Advanced Search
Search Results
17 total results found
Part 1. Solder Paste, Stencils & Printing (with in-line SPI)
Printing is not just "applying glue"; it is the foundation of quality in SMT assembly. Studies consistently show that 60-70% of all soldering defects originate here. This chapter breaks down the science of getting the right amount of paste in the right place, ...
Part 2. Pick-and-Place & Conveyors (programs, feeders, line control)
The pick-and-place machine is the heartbeat of your SMT line—where speed must meet sub-micron accuracy. Failure to optimize this stage results in feeder errors, downtime, and scrap. This chapter ensures your entire placement ecosystem runs flawlessly. We focu...
Part 3. Reflow Soldering (profiles, atmosphere, defects)
Reflow is the final thermal challenge where heat management dictates the reliability of every solder joint. A poor profile means component damage, voiding, and brittle failures. This chapter gives you the thermal control strategy: The Profile: Mastering the ...
Part 4. In-Line Optical & X-Ray Inspection (SPI recap, AOI, AXI, SPC)
Inspection is the data engine that makes your SMT line predictable. This chapter covers the tools that measure quality and drive process control. Key technologies and their functions: SPI (Solder Paste Inspection): Measures paste volume/area to calculate pro...
Part 5. Electrical Test (ICT, FCT, boundary scan)
Testing is the financial and technical firewall that stops bad product from shipping. This chapter covers the layered electrical test strategy required to achieve high coverage, speed, and reliability. We detail the three main pillars of modern board testing:...
Part 1. Automated THT: Selective & Wave (setup, profiling, defects)
THT provides the mechanical reliability anchor on mixed boards, relying heavily on chemistry and fluid dynamics. This chapter focuses on mastering automated mass soldering for strong, void-free joints. We detail the critical process elements: Pre-Soldering: ...
Part 2. Manual THT & Rework (tools, techniques, defect atlas)
Manual soldering and rework are the final human element, demanding professional skill to ensure every repair is reliable and auditable. We cover the critical steps: Foundation: Mastering tool control—temperature, tip selection, and dwell time—for robust hand...
Part 3. Cleaning, Depanelization, Press-Fit, Conformal Coating/Potting
Your product's long-term lifespan is decided after soldering. This chapter shows how to achieve true environmental durability and mitigate failure risk in the final assembly stages. We secure the board's integrity by mastering: Cleanliness: The critical Clea...
Part 1. Design & Material Foundation (DFM)
Connecting point A to B is simple. Making it survive the real world is engineering. This chapter breaks down the foundation needed to turn a concept into a reliable product. We cover the critical pillars of a robust design: Environmental Requirements: Defini...
Part 2. Process Preparation (Cut, Strip, Prep)
Great harnesses aren't just designed; they are manufactured through disciplined repetition. This chapter moves from theory to the factory floor, transforming raw spools into precision components. We break down the critical sequence required to build a consist...
Part 3. Termination: The Critical Interface
This is where the connection actually happens—and where most failures begin. This chapter focuses on the science of the interface, ensuring every contact is mechanically sound and electrically invisible. We dive into the specific technologies that make or bre...
Part 1. Box Build Overview & Planning
This is the culmination of manufacturing—where components become the final, customer-ready product. It’s high-risk because functional, safety, and cosmetic quality converge here. We cover the fundamentals for predictable flow: Complexity: Defined by intercon...
Part 2. Mechanical Assembly
This is where the digital meets the physical — and where cheap mechanical errors lead to expensive field failures. This chapter focuses on the disciplined physical integration required to build a product that survives handling and environmental stress. We det...
Part 3. Interconnect & Integration
Wiring integrity is where your electronics become a reliable system, not just components in a box. This chapter details the crucial integration strategy that prevents performance loss and field failures. We secure the system by mastering: Harness Discipline:...
Part 4. Final Test & Configuration
This is the decisive stage where the assembled product is fully verified for safety, function, and reliability. This is your last guarantee before shipment. We secure quality through: Verification: Confirming operation (FCT) and mandatory electrical isolatio...
Part 5. Packing & Logistics
This is the final layer of quality, ensuring your perfect product reaches the customer safely. Key steps: Presentation: Final cosmetic check and cleaning.Protection: Selecting the right packaging (ESD, cushioning) for the shipping route.Identity: Applying re...