02. Engineering Inputs & The Golden Data Pack
The non-negotiable release package that prevents build failures and rework.
Part 1. Release Governance and Golden Data Pack (GDP) Core
1.1 The GDP Standard: Formats, Directory & Integrity
Production failure begins with data ambiguity. If the input data is fluid, the manufacturing outp...
1.2 The Bill of Materials (BOM) & Revision Control
The Bill of Materials (BOM) is not merely a purchasing list; it is the primary driver for SMT pro...
1.3 CAD/CAM Outputs: Fabrication Package Definition
The fabrication package is the blueprint for the physical substrate. If this data is incomplete, ...
1.4 Assembly Outputs: Centroid, Rotations, Polarity and Stencil Inputs
SMT programming is not an interpretative art; it is a coordinate translation task. If the input d...
1.5 Release Checklist and Freeze Rules
For an EMS provider, the NPI Gate is the primary defense against liability. Once you accept a dat...
1.6 Engineering Queries, ECO and Deviation Control
Informal agreements via instant messaging, email threads, or verbal confirmations are non-existen...
Part 2. Manufacturing Specifications: PCB + PCBA Process
2.1 Material Science, Stackups and Via Architecture
A printed circuit board defined solely by Gerber files is a suggestion, not a specification. With...
2.2 Surface Finishes and Panelization Strategy
The physical interface between the component and the PCB is defined by two factors: the planarity...
2.3 Land Patterns, Spacing and Polarity
A component footprint is not merely a drawing; it is a prediction of how molten solder will behav...
2.4 Process Specs: Alloys, Stencils and Chemistry
Soldering is not applying conductive glue; it is a complex metallurgical process relying on phase...
2.5 Workmanship and Acceptance Criteria
Quality cannot be negotiated after the solder has cooled. Subjective terms like "good enough," "n...
Part 3. Process Validation & The MP Gate
3.1 NPI Supply Chain: Consignment, Kitting and Attrition
NPI Supply Chain is not about moving pallets; it is about forensic auditing. In the prototype pha...
3.2 NPI Component Handling: MSL Hygiene and Feeder Readiness
In Mass Production, components arrive in factory-sealed, vacuum-packed reels. In NPI, components ...
3.3 Firmware and Test Specification (DFT)
Hardware without validated firmware is strictly inert matter—silicon and copper that consumes cap...
3.4 FAI Build Evidence Pack and MP Release
First Article Inspection (FAI) is the forensic audit of the manufacturing process. It does not me...
Part 4. Box Build GDP and System Integration
4.1 System BOM and Mechanical BOM (MBOM)
A missing $0.02 screw stops a production line just as effectively as a missing $50.00 processor. ...
4.2 Mechanical CAD Package and Drawings
A perfect 3D model does not guarantee a perfect part. Manufacturing partners cannot inspect a phy...
4.3 Wiring Harness and Cable Assembly Pack
Cable assemblies are the "nervous system" of the product, yet they are frequently the most under-...
4.4 Mechanical Assembly WI: Torque, Sealants, TIM and ESD Controls
The Box Build process is where "tribal knowledge" destroys consistency. If the assembly sequence ...
4.5 Labels, Serialization, and Regulatory Technical File
A label is not merely a sticker; it is the product's legal passport. A perfectly functional devic...
4.6 System Test, Calibration, and Pack-Out Specification
A PCBA that passes In-Circuit Test (ICT) is not a finished product. System integration introduces...