Part 2. PCB Fabrication Specifications (The Substrate)

The Printed Circuit Board is the mechanical, thermal, and electrical backbone of the product—not just a flat piece of fiberglass. The quality of the final assembly is predetermined by the substrate specifications.

This section covers the critical inputs that lock in board quality:

• Substrate DNA: Defining material science, stackups, and via architecture to manage signal integrity and thermal performance.
• Wetting and Assembly: Selecting the correct surface finishes (e.g., ENIG, HASL) that guarantee reliable solder joint integrity.
• Factory Flow: Planning the panelization strategy to optimize machine handling and subsequent depanelization without component stress.

Defining these specs precisely is mandatory to prevent material-related failures during both assembly and field use.