3.2 Component Handling: MSL & Feeder Compatibility

Electronic components are environmentally sensitive devices that require rigorous environmental controls to prevent catastrophic failure during reflow. Furthermore, the physical format of the component carrier determines whether the SMT machine can feed the part or if manual placement is required.

Moisture Sensitivity Level (MSL)

Plastic encapsulated ICs absorb ambient moisture. During reflow, this moisture expands rapidly, causing "popcorn" cracking and delamination. Compliance with IPC/JEDEC J-STD-033 is mandatory.

• MSL 3, 4, 5: Parts must be received in vacuum-sealed Moisture Barrier Bags (MBB) with a Humidity Indicator Card (HIC) and Desiccant.
• Exposure Tracking: If the HIC indicates humidity > 10% (pink color), or if the "Floor Life" (exposure time) is exceeded, the parts must undergo a Bake Cycle (e.g., 48 hours at 125 C) before use. This impacts lead time.

Feeder Compatibility (Tape & Reel)

High-speed placement machines require continuous tape.

• Leader & Trailer: Cut tape strips must have a minimum of 100 mm empty leader (pockets with cover tape) to allow the feeder mechanism to engage.
• Splicing: Adjoining reels must be spliced using brass shims or ESD-safe tape. Standard EIA-481 governs tape dimensions (8mm, 12mm, 16mm, etc.).
• Short Strips: Strips shorter than the minimum leader length require "Tray" or "Stick" feeding, which significantly reduces placement speed (CPH) and incurs manual handling surcharges.

Final Checklist