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3.9 Defect Atlas & Acceptance
Defect evaluation sits at the intersection of quality, speed, and fairness in electronics manufac...
3.8 Rework Flow Control
Reworking complex surface mount devices (SMD), such as BGAs and QFNs, is one of the most delicate...
3.7 Fluxes, Alloys and Aids
Hand soldering is a controlled process, but its chemical core relies on the quality and purity of...
3.6 Hand Soldering Foundations
Hand soldering remains essential for rework, repair, and specialized low-volume assembly, managin...
3.5 Common Defects & Corrections
Solder balls, non-fills, and bridging are often not defects of the solder wave itself, but failur...
3.4 Wave Solder Setup
Wave soldering is the original mass production technique, and its effectiveness is determined by ...
3.3 Selective Solder Programming
Selective soldering is the high-precision solution for mixed-technology boards, solving the probl...
3.2 Fluxing & Preheat Control
The perfect solder joint begins with chemistry and heat. Through-hole soldering is a high-risk th...
3.1 THT-Friendly Design
Through-Hole Technology (THT) remains mandatory for mechanical stability (connectors, relays), hi...
2.26 Data Logging & Repair Tickets
Data logging and the formal Repair Ticket system are the nervous system of modern electronics man...
2.25 Functional Test Design
Functional Test (FCT) is the final stage of the electrical quality strategy, confirming that the ...
2.24 Boundary Scan Essentials (JTAG)
Boundary Scan, formalized as IEEE 1149.1 (JTAG), is a mandatory technology for structural testing...
2.23 ICT & Fixture Design
In-Circuit Test (ICT) is the fastest, most effective way to eliminate 90% of all common structura...
2.22 Strategy & Coverage
Electrical test is not an option; it is a financial and technical firewall. The goal of a well-de...
2.21 SPC & Dashboards
Statistical Process Control (SPC) is the operational discipline that converts raw machine data in...
2.20 Programming & Tuning
Inspection programming translates raw component and solder data into actionable pass/fail judgmen...
2.19 AXI Techniques
Automated X-ray Inspection (AXI) is a critical, non-destructive testing method that uses X-ray te...
2.18 AOI Fundamentals
Automated Optical Inspection (AOI) systems function as the visual quality gate of the SMT line. U...
2.17 SPI Recap & Cp/Cpk
Solder Paste Inspection (SPI) transforms the stencil printing process from a manual art into a pr...
2.16 Defect Mechanisms & Fixes
Reflow soldering defects are the consequence of failed controls upstream: paste, stencil, placeme...