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3.5 Defect Mechanisms & Fixes
Reflow soldering defects are the consequence of failed controls upstream: paste, stencil, placeme...
3.4 Alloy-Specific Nuances
Every solder alloy possesses a unique thermal and metallurgical signature that dictates its requi...
3.3 Air vs Nitrogen
The atmosphere inside the reflow oven is a direct variable in solder joint formation and reliabil...
3.2 Profiling Methods
Profiling is a distinct step from zone control. While previous chapter addressed the physics of h...
3.1 Heat Transfer & Zone Control
The reflow oven is the final, irreversible step in Surface Mount Technology (SMT), where the mech...
2.5 First Article & Golden Board
The First Article (FA) procedure is the mandatory process gate that confirms a product is ready f...
2.4 Board Handling & Line Control
The flow of panels between SMT stations — handled by conveyors, buffers, and communication links ...
2.3 Feeders, Splicing & Replenishment
Feeder performance is the silent determinant of pick-and-place uptime. Even the fastest machine s...
2.2 Program Creation & Tuning
A pick-and-place machine's performance is governed by the program that drives it. From the moment...
2.1 Machine Architectures
Machine architecture defines the DNA of the Surface Mount Technology (SMT) line, establishing a f...
3.5 Coating & Potting
Residues left behind in assembly are often invisible, yet they can dictate whether a circuit surv...
3.4 Press-Fit Technology
Press-fit is a mechanical interconnection technology that uses a compliant pin design to create a...
3.3 Depanelization Choices
Depanelization is the final mechanical process that separates individual Printed Circuit Boards (...
3.2 Cleaning Methods & Fixtures
Residues left behind in assembly are often invisible, yet they can dictate whether a circuit surv...
3.1 Clean vs No-Clean Decisions
Residues left behind in assembly are often invisible, yet they can dictate whether a circuit surv...
2.6 Rework & Repair
Rework and repair are invasive procedures that carry a high risk of Collateral Damage (CD) to the...
2.5 Data Logging & Repair Tickets (THT/Mixed)
The manual and mixed-technology assembly process — especially THT insertion, wave soldering, and ...
2.4 Defect Atlas & Acceptance
Defect evaluation sits at the intersection of quality, speed, and fairness in electronics manufac...
2.3 Rework Flow Control
Reworking complex surface mount devices (SMD), such as BGAs and QFNs, is one of the most delicate...
2.2 Fluxes, Alloys and Aids
Hand soldering is a controlled process, but its chemical core relies on the quality and purity of...