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2.15 Alloy-Specific Nuances
Every solder alloy possesses a unique thermal and metallurgical signature that dictates its requi...
2.14 Air vs Nitrogen
The atmosphere inside the reflow oven is a direct variable in solder joint formation and reliabil...
2.13 Profiling Methods
Profiling is a distinct step from zone control. While previous chapter addressed the physics of h...
2.12 Heat Transfer & Zone Control
The reflow oven is the final, irreversible step in Surface Mount Technology (SMT), where the mech...
2.11 First Article & Golden Board
The First Article (FA) procedure is the mandatory process gate that confirms a product is ready f...
2.10 Board Handling & Line Control
The flow of panels between SMT stations — handled by conveyors, buffers, and communication links ...
2.9 Feeders, Splicing & Replenishment
Feeder performance is the silent determinant of pick-and-place uptime. Even the fastest machine s...
2.8 Program Creation & Tuning
A pick-and-place machine's performance is governed by the program that drives it. From the moment...
2.7 Machine Architectures
Machine architecture defines the DNA of the Surface Mount Technology (SMT) line, establishing a f...
2.6 SPI Metrics and Closed Loop
SPI (Solder Paste Inspection) is your 3D radar for printing quality. It doesn't just catch defect...
2.5 Printer Setup & Cleaning
The screen printer is where perfect design meets physical reality. Its setup is a high-impact, lo...
2.4 Aperture Design Tactics
Aperture design is where physics meets geometry to determine printing stability and final joint q...
2.3 Stencil Types & Thickness
The stencil is where the two critical elements of SMT — the paste and the PCB — first meet. Its g...
2.2 Storage, Thawing & Handling
Solder paste is not a simple commodity; it is a fragile chemical system with an expiration date, ...
2.1 Paste Chemistry & Alloy Choice
Solder paste is the nervous system of Surface Mount Technology (SMT). Its chemical mix dictates e...