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1.7 Counterfeit Avoidance (AS5553)

Counterfeit components are not merely a financial nuisance; they are a system contagion. A single remarked component can pass functional test at board level, only to fail in the field due to thermal mismatch or latent ESD damage, triggering catastrophic liability. The goal of this architecture is Zero Contamination. We do not "manage" counterfeits; we physically exclude them through rigid sourcing hierarchies and forensic validation.

The Sourcing Hierarchy

Risk is determined by the Chain of Custody (CoC). The sourcing path dictates the inspection rigor.

Tier 1: The Secure Channel (Preferred)

  • Definition: Original Component Manufacturer (OCM) or Franchised/Authorized Distributor.
  • Status: Green.
  • Requirement: Direct traceability to OCM. Manufacturer CoC required.
  • Risk: Near Zero.

Tier 2: The Open Market (Broker/Independent)

  • Definition: Non-franchised independent distributors.
  • Status: Red (Restricted).
  • Requirement: Requires "Line Down" executive waiver.
  • Risk: High. Material is presumed suspect until proven innocent via forensic testing.

Risk-Based Evidence Requirements

The documentation and testing burden scales with the opacity of the source.

Risk Class

Source Type

Documentation Required

Inspection / Testing Mandate

Class I

OCM / Authorized

Mfg CoC + Packing Slip

Standard Incoming Inspection (qty, damage, label)

Class II

Broker (Traceable)

3rd Party CoC + Trace Docs

Enhanced Visual (Microscope 30x) + Solvency Check

Class III

Broker (No Trace)

Invoice Only

Full AS6081 Testing (X-Ray, Decap, XRF, Electrical)

Pro-Tip: Acetone swabbing (checking for "blacktopping" or remarking) is the cheapest, fastest litmus test. If the top coating dissolves or the ink smears with acetone, the part is fake. Do this before paying for expensive X-Rays.

The Decision Logic (Sourcing & Validation)

Apply this logic flow to every incoming lot.

Step 1: Determine Channel Validity

  • If Source is Authorized:
    • Then Verify CoC matches label → Accept.
  • If Source is Broker:
    • Then Move to Step 2.

Step 2: Broker Risk Mitigation (AS6081 Protocol)

  • If Component is Active (IC/FET) OR High-Value:
    • Then Execute Destructive Analysis (Sample Size: 3 units).
      • Decapsulation: Verify die markings match OCM datasheet.
      • X-Ray: Verify bond wire integrity and die attach.
      • XRF: Verify lead finish (Pb vs. Pb-Free) matches part number suffix.
  • If Analysis = FAIL:
    • Then Trigger Quarantine Protocol.

Quarantine & Disposition: The "Kill Chain"

If a part is flagged as suspect, it must be treated as hazardous material to prevent accidental use.

Immediate Containment (Physical)

  • Action: Seize all parts. Do not return them to the vendor immediately (prevents resale to others).
  • Storage: Lock in "Red Cage" (segregated quarantine area).
  • Tag: Apply red "NON-CONFORMING / SUSPECT COUNTERFEIT" label.

Notification & Reporting

  • Internal: Notify Supply Chain Director and Quality Manager.
  • External: File report with GIDEP (Government-Industry Data Exchange Program) or ERAI if counterfeit is confirmed by lab report.

AVL Feedback Loop

  • Logic:
    • If Vendor supplied Counterfeit:
      • Then Status = Blacklisted (Permanent).
    • If Vendor supplied Used/Refurbished as "New":
      • Then Status = Probation (Pending Audit).
  • Financial: Initiate escrow claw-back or credit hold immediately.

Final Checklist

Control Point

Requirement

Critical Threshold

Sourcing Rule

Authorized Channel Priority

> 95% of Spend

Broker Waiver

Executive Sign-off

Required for Any Broker Buy

Validation

Class III Testing (Decap/X-Ray)

100% of Broker Lots

Visual Check

Microscope Inspection (Lead condition)

100% of Incoming Lots

Solvent Test

Resistance to Remarking (H106)

Sample of 1 per lot

Disposition

Suspect Part Reporting

GIDEP / ERAI Submission