6.2 Put-away & Location Control
Put-away is the translation of "possession" into "availability." A component sitting physically on a shelf but digitally unassigned is a Phantom Shortage waiting to happen. The system will trigger urgent re-orders while the stock collects dust just meters away. The objective of Put-away is absolute synchronization: the physical reality and the digital map must be identical at all times.
The "Scan-to-Location" Protocol
Eliminate memory-based transactions. The ERP update must occur simultaneously with the physical movement, not as a batch job at the end of the shift.
- The Atomic Transaction:
- Transport material to the target zone.
- Scan the Bin Location Label (Destination).
- Scan the Part ID/License Plate (Item).
- Confirm Quantity.
- Place item in bin.
- Logic:
- If the scanner is not in your hand → Then do not move the box.
- If the system suggests Bin A-01 but it is full → Then scan an alternative "Overflow" location immediately. Do not stack it on the floor "just for now."
- If you find an item in a bin that the system thinks is empty → Then trigger a Cycle Count flag immediately.
Broken Packs & "Orphan" Management
In electronics assembly, the highest risk of inventory loss comes from "Cut Tape" and partial reels. Once the manufacturer's moisture barrier bag (MBB) or reel is opened, the identity is easily lost.
- The "Orphan" Rule: Never separate a component from its identity.
- If cutting a strip of tape for a sample or kit → Then ensure the Manufacturer Label remains with the main stock.
- If the remaining strip is too short to hold the original label → Then generate an Internal UID Label (containing MPN, Lot, Qty) and affix it to the bag holding the strip.
- The Unidentified Strip:
- If a loose strip of passive components is found without a label → Then Scrap immediately. Do not attempt to measure and guess. The risk of mixing 10kΩ and 10.1kΩ is too high.
Pro-Tip: Use clear, ESD-safe ziplock bags for all cut tape. Stick the label on the BAG, not the tape. Labels on the tape itself can jam the SMT feeders.
Location Strategy & Segregation
Do not treat all inventory slots equally. Configure the warehouse based on velocity and physical characteristics.
- Velocity Slotting:
- If Part is Class A (High Frequency) → Then slot in the "Golden Zone" (waist height, near kitting area) to minimize travel time.
- If Part is Class C (Slow/Sporadic) → Then slot in high/low racking or vertical carousels.
- Mixed Bin Rules:
- Ideal State: One SKU per Bin ID.
- Reality (High Density): If mixing is required (e.g., partitioned drawers):
- If parts look identical (e.g., different resistors) → Then never store them in adjacent compartments. Separate them visually to break the picker's "autopilot."
- ESD Constraint: All active components (ICs, transistors) must be stored in Conductive or Static-Dissipative bins/totes. Pink Poly is insufficient for long-term storage of sensitive items.
Final Checklist
Control Point | Critical Rule | KPI / Metric |
Transaction Timing | Real-time scan required. No "batching" paper tickets. | Dock-to-Stock Time: Target < 24 hours. |
Location Accuracy | 0% tolerance for "Unknown Location." | Mislocation Rate: Target 0 PPM. |
Partial Units | Every cut strip/open bag must have a readable UID label. | Unidentifiable Scrap Cost: Trend down to $0. |
Bin Hygiene | No mixed SKUs in a single bin without rigid dividers. | Picking Error Rate: Correlate to mixed bins. |
Overflow | If primary bin is full, secondary location must be system-tracked. | Inventory Accuracy: > 99.5% by location. |