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2.3 Mounting PCBAs, Displays and Modules
The installation of sensitive electronic components into the chassis is the point where electrica...
2.2 Fasteners, Torque and Thread Management
Fastener installation is the most frequent and most vulnerable mechanical operation in Box Build....
2.1 Chassis and Enclosure Preparation
Chassis and enclosure preparation is the mandatory foundation that dictates the success of final ...
1.5 Assembly Flow Design
Assembly flow design is the process of structuring the physical sequence of work and allocating l...
1.4 Work Instructions and Visual Aids
Effective Work Instructions (WIs) are the backbone of a high-quality Box Build operation, standar...
1.3 BOM, Subassemblies & Kitting
Effective management of the Bill of Materials (BOM), sub-assemblies, and kitting is the most crit...
1.2 Box Build Complexity Tiers and Risk Mandates
Classification of Box Build products by complexity is a mandatory exercise for accurate resource ...
1.1 What is Box Build (System Integration)
Box Build, often referred to as System Integration or Final Assembly, is the manufacturing stage ...
6.2 Maintenance & Calibration
While Book 07 covers facility-wide strategies, this chapter defines the specific, tactical mainte...
6.1 Changeover Reduction (SMED)
In high-mix electronics manufacturing, the greatest threat to OEE (Overall Equipment Effectivenes...
5.5 Data Logging & Repair Tickets
Data logging and the formal Repair Ticket system are the nervous system of modern electronics man...
5.4 Functional Test Design
Functional Test (FCT) is the final stage of the electrical quality strategy, confirming that the ...
5.3 Boundary Scan Essentials (JTAG)
Boundary Scan, formalized as IEEE 1149.1 (JTAG), is a mandatory technology for structural testing...
5.2 ICT & Fixture Design
In-Circuit Test (ICT) is the fastest, most effective way to eliminate 90% of all common structura...
5.1 Strategy & Coverage
Electrical test is not an option; it is a financial and technical firewall. The goal of a well-de...
4.5 SPC & Dashboards
Statistical Process Control (SPC) is the operational discipline that converts raw machine data in...
4.4 Programming & Tuning
Inspection programming translates raw component and solder data into actionable pass/fail judgmen...
4.3 AXI Techniques
Automated X-ray Inspection (AXI) is a critical, non-destructive testing method that uses X-ray te...
4.2 AOI Fundamentals
Automated Optical Inspection (AOI) systems function as the visual quality gate of the SMT line. U...
4.1 SPI Recap & Cp/Cpk
Solder Paste Inspection (SPI) transforms the stencil printing process from a manual art into a pr...