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Part 4. The Physical Network (Logistics)
Part 5. Supplier Performance & Development
Part 2. Workmanship Standards
Part 3. The Audit Architecture
Part 4. Supplier Quality Management
Part 5. Process Control & Metrics
Part 6. Measurement & Validation
Part 7. Advanced Planning (NPI)
Part 8. Continuous Improvement
Part 6. Changeover and Maintenance
Part 4. The Employee Lifecycle (People Ops)
The effectiveness of any organization is directly proportional to the quality and engagement of its personnel. This section formalizes the People Operations (People Ops) processes, defining the standards and expectations across the entire employee lifecycle — ...
Part 1. The Golden Data Pack (GDP) Specification
Manufacturing execution begins and ends with the data integrity of the engineering release. This section defines the Golden Data Pack (GDP), the single, mandatory source of truth required to initiate production. The GDP standardizes: Design-to-Factory Bridge...
Part 2. PCB Fabrication Specifications (The Substrate)
The Printed Circuit Board is the mechanical, thermal, and electrical backbone of the product—not just a flat piece of fiberglass. The quality of the final assembly is predetermined by the substrate specifications. This section covers the critical inputs that ...
Part 3. Component Logistics & Handling
The warehouse is not just storage; it is the first active stage of production. This section details the physical discipline required to prevent logistical chaos from becoming a manufacturing defect. We define the protocols for: Supply Chain Hygiene: Preventi...
Part 4. DFM & Assembly Specifications (The Process)
A perfect schematic means nothing if the board cannot be manufactured at scale. This section bridges the critical gap between digital CAD design and the physics of soldering. It covers the essential translation layers: Geometric Precision: Defining precise l...
Part 5. Data Validation & Handoff
Data handoff is the final gate where digital intent becomes physical reality. This section defines the protocols that prevent "garbage in, garbage out" scenarios. It details: DFT & Firmware: Defining the test access points and programming files required to w...
Part 3. The Process – Orchestration and Verification
From Digital Design to Physical Product This part details the transformation of raw materials into finished devices. It covers the physics of the SMT line, the craftsmanship of manual assembly, the mechanics of box build, and the rigorous digital testing gates...
Part 1. The Industrial Ecosystem
Business Models, Economics, and Global Logistics This part demystifies the commercial machinery behind the physical product. It defines the contractual relationships (OEM vs. EMS), the financial transparency of the Open BOM, and the strategic geography of the ...
Part 2. The Architecture of the PCB
Materials, Anatomy, and Component Topography This part treats the Printed Circuit Board not as a component, but as a complex urban structure. It breaks down the physical geology of the board (FR4, Copper, Vias) and the taxonomy of the population (Active and Pa...