5.3 Customer Complaints → Containment → 8D/CAPA

Unresolved field failures degrade contract margins and invite liability claims. A complaint is not merely a service ticket; it is a signal of process control deviation. Treat every external defect report as a system breach requiring immediate physical containment and root-cause termination to prevent recurrence.

Phase 1: Immediate Containment (D0)

Execute containment within 4 hours of notification to sever the defect stream. Do not wait for root cause validation.

Triage Logic

• IF defect involves safety/thermal/battery risk → THEN initiate Global Stop Ship immediately.
• IF defect rate ≥ 1% (Epidemic Failure) → THEN Freeze FG (Finished Goods) + Purge WIP (Work in Progress).
• IF defect is cosmetic/isolated (< 0.1% AQL) → THEN Flag batch for 100% OBA (Out of Box Audit) + Proceed with shipment.

Physical Quarantine

1. Identify all lots with matching Date Code/Lot ID/Vendor Code.
2. Segregate suspect inventory to the Red Zone (MRB Cage).
3. Tag physically with DO NOT USE labels.
4. Block electronically in ERP/WMS to prevent accidental picking.

Pro-Tip: Operations teams often freeze FG but forget In-Transit stock. Redirect shipments currently with forwarders back to the hub for inspection to avoid DOA at the customer site.

Phase 2: Evidence & MRB Coordination

Data integrity determines 8D validity. Corrupt evidence leads to NDF (No Defect Found) conclusions and repeat failures.

Evidence Pack Requirements

• High-Res Photos: Macro shots of the failure site (PCB, Solder Joint, Screen) vs. Golden Sample.
• Log Files: Dump serial logs/event history for the specific unit UUID.
• Traceability: Extract full genealogy (Solder Paste Inspection, Reflow Profile, AOI Images) for the specific board serial number.

MRB (Material Review Board) Protocol

• Inspect: Perform non-destructive testing (X-Ray/Visual) first.
• Destruct: Cross-section/Dye-and-Pry only after high-res imaging is archived.
• Disposition:
  • Rework: Only if approved Process Instruction (MPI) exists.
  • Scrap: If reliability is compromised (e.g., PCB delamination).
  • RTV (Return to Vendor): If failure is traced to raw component supplier.

Phase 3: 8D Execution Timeline & SLA

Adhere to the standard 8D (Eight Disciplines) timeline to maintain customer confidence and engineering discipline.

Root Cause Validation Rule

• IF Root Cause is "Operator Error" → THEN Reject 8D. (Human error is a symptom of weak process design/fixturing).
• IF Root Cause is "Machine Malfunction" → THEN Show maintenance logs + calibration drift data.

Phase 4: Customer Communication & Outputs

Standardize the output to reduce back-and-forth email friction.

The 8D Pack Structure

1. Summary Slide: Problem Statement (5W1H) + Risk Assessment.
2. Containment Data: Qty sorted, Qty failed, Qty clean.
3. Technical Analysis: X-Ray images, EDX material analysis, Cross-section microscopy.
4. Corrective Action: Before/After evidence (e.g., "Old fixture vs. New fixture design").
5. Control Plan: Updated CP/FMEA excerpt showing the new detection node.

Final Checklist